|
Intel Corporation |
E
PRELIMINARY
BYTE-WIDE
SMART 3 FlashFile™ MEMORY FAMILY
4, 8, AND 16 MBIT
28F004S3, 28F008S3, 28F016S3
Includes Commercial and Extended Temperature Specifications
n SmartVoltage Technology
Smart 3 Flash: 2.7 V or 3.3 V VCC
and 2.7 V, 3.3 V or 12 V VPP
n High-Performance
120 ns Read Access Time
n Enhanced Data Protection Features
Absolute Protection with VPP = GND
Flexible Block Locking
Block Write Lockout during Power
Transitions
n Enhanced Automated Suspend Options
Program Suspend to Read
Block Erase Suspend to Program
Block Erase Suspend to Read
n Industry-Standard Packaging
40-Lead TSOP, 44-Lead PSOP
and 40 Bump µBGA* CSP
n High-Density 64-Kbyte Symmetrical
Erase Block Architecture
4 Mbit: Eight Blocks
8 Mbit: Sixteen Blocks
16 Mbit: Thirty-Two Blocks
n Extended Cycling Capability
100,000 Block Erase Cycles
n Low Power Management
Deep Power-Down Mode
Automatic Power Savings Mode
Decreases ICC in Static Mode
n Automated Program and Block Erase
Command User Interface
Status Register
n SRAM-Compatible Write Interface
n ETOX™ V Nonvolatile Flash
Technology
Intel’s byte-wide Smart 3 FlashFile™ memory family renders a variety of density offerings in the same
package. The 4-, 8-, and 16-Mbit byte-wide FlashFile memories provide high-density, low-cost, nonvolatile,
read/write storage solutions for a wide range of applications. Their symmetrically-blocked architecture, flexible
voltage, and extended cycling provide highly flexible components suitable for resident flash arrays, SIMMs,
and memory cards. Enhanced suspend capabilities provide an ideal solution for code or data storage
applications. For secure code storage applications, such as networking, where code is either directly
executed out of flash or downloaded to DRAM, the 4-, 8-, and 16-Mbit FlashFile memories offer three levels
of protection: absolute protection with VPP at GND, selective hardware block locking, or flexible software
block locking. These alternatives give designers ultimate control of their code security needs.
This family of products is manufactured on Intel’s 0.4 µm ETOX™ V process technology. They come in
industry-standard packages: the 40-lead TSOP, ideal for board-constrained applications, and the rugged
44-lead PSOP. Based on the 28F008SA architecture, the byte-wide Smart 3 FlashFile memory family
enables quick and easy upgrades for designs that demand state-of-the-art technology.
December 1997
Order Number: 290598-004
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of
Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life
saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The 28F004S3, 28F008S3, 28F016S3 may contain design defects or errors known as errata which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call 1-800-548-4725
or visit Intel’s Website at http:\\www.intel.com
COPYRIGHT © INTEL CORPORATION, 1997
*Third-party brands and names are the property of their respective owners.
CG-041493
|