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VS-100MT160P-P 반도체 회로 부품 판매점

MTP PressFit Power Module



Vishay 로고
Vishay
VS-100MT160P-P 데이터시트, 핀배열, 회로
VS-40MT160P-P, VS-70MT160P-P, VS-100MT160P-P
www.vishay.com
Vishay Semiconductors
MTP PressFit Power Module
Three Phase Bridge, 45 A to 100 A
MTP PressFit
PRODUCT SUMMARY
IO
VRRM
Package
Circuit
45 A to 100 A
1600 V
MTP PressFit
Three phase bridge
FEATURES
• Low VF
• Low profile package
• Direct mounting to heatsink
• PressFit pins technology
• Low junction to case thermal resistance
• 3500 VRMS insulation voltage
• UL approved file E78996
• Designed and qualified for industrial level
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Power conversion machines
• Welding
• UPS
• SMPS
• Motor drives
• General purpose and heavy duty application
DESCRIPTION
The new MTP module is easy to use thanks to solder less
method for contacting PressFit pins to the PCB. The low
profile package has been specifically conceived to
maximize space saving and optimize the electrical layout of
the application specific power supplies.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL CHARACTERISTICS
VALUES
40MT
IO
IFSM
TC
50 Hz
60 Hz
45
100
270
280
50 Hz
I2t
60 Hz
I2t
365
325
3650
VRRM
TStg
TJ
Range
VALUES
70MT
75
80
380
398
724
660
7240
1600
-40 to +125
-40 to +150
VALUES
100MT
100
80
450
470
1013
920
10 130
UNITS
A
°C
A
A2s
A2s
V
°C
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE NUMBER
VOLTAGE CODE
REVERSE VOLTAGE
V
VS-40MT160P-P, VS-70MT160P-P,
VS-100MT160P-P
160
VRRM, MAXIMUM
REPETITIVE PEAK
REVERSE VOLTAGE
V
1600
VRSM, MAXIMUM
IRRM MAXIMUM AT
NON-REPETITIVE PEAK
TJ = 150 °C
V mA
1700
5
Revision: 18-Mar-14
1 Document Number: 94870
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000


VS-100MT160P-P 데이터시트, 핀배열, 회로
VS-40MT160P-P, VS-70MT160P-P, VS-100MT160P-P
www.vishay.com
Vishay Semiconductors
FORWARD CONDUCTION
PARAMETER
SYMBOL
Maximum DC output
current at case
temperature
IO
Maximum peak, one cycle
forward, non-repetitive on
state surge current
IFSM
Maximum I2t for fusing
I2t
Maximum I2t for fusing
Value of threshold voltage
Slope resistance
Maximum forward voltage
drop
I2t
VF(TO)
rt
VFM
TEST CONDITIONS
120° rect. to conduction angle
t = 10 ms
t = 8.3 ms
No voltage
reapplied
t = 10 ms
t = 8.3 ms
t = 10 ms
t = 8.3 ms
100 % VRRM
reapplied
No voltage
reapplied
Initial
TJ = TJ maximum
t = 10 ms
t = 8.3 ms
100 % VRRM
reapplied
t = 0.1 ms to 10 ms, no voltage reapplied
TJ maximum
TJ = 25 °C; tp = 400 μs single junction
(40MT, Ipk = 40 A) (70MT, Ipk = 70 A) (100MT, Ipk = 100 A)
VALUE
40MT
45
100
270
280
225
240
365
325
253
240
3650
0.78
14.8
1.45
VALUES
70MT
75
80
380
398
320
335
724
660
512
467
7240
0.82
9.5
1.45
VALUES
100MT
100
80
450
470
380
400
1013
920
600
665
10 130
0.75
8.1
1.51
UNITS
A
°C
A2s
A2s
V
m
V
INSULATION TABLE
PARAMETER
SYMBOL
RMS insulation voltage
VINS
TEST CONDITIONS
TJ = 25 °C, all terminal shorted, f = 50 Hz, t = 1 s
40MT
70MT
3500
100MT
UNITS
V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Maximum junction operating
temperature range
TJ
Maximum storage
temperature range
TStg
DC operation per module
Maximum thermal resistance,
junction to case
RthJC
DC operation per junction
120° rect. condunction angle per module
120° rect. condunction angle per junction
Maximum thermal resistance,case to
heatsink per module
RthCS
Mounting surface smooth, flat and greased
Heatsink compound thermal conductivity
= 0.42 W/mK
Mounting torque to heatsink
± 10 %
Approximate weight
A mounting compound is recommended
and the torque should be rechecked after a
period of 3 hours to allow for the spread of
the compound. Lubricated threads
40MT 70MT 100MT
- 40 to 150
- 40 to 125
0.27
1.6
0.38
2.25
0.23
1.38
0.29
1.76
0.19
1.14
0.22
1.29
0.1
4
65
UNITS
°C
K/W
Nm
g
CLEARANCE AND CREEPAGE DISTANCES
PARAMETER
TEST CONDITIONS
Clearance
External shortest distances in air between terminals
which are not internally short circuited together
Creepage distance
Shortest distance along external surface of the insulating material
between terminals which are not internally short circuited together
MTP PressFit
10.2
13
UNITS
mm
Revision: 18-Mar-14
2 Document Number: 94870
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000




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MTP PressFit Power Module - Vishay