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Advanced Ceramic X |
CP1005 Series (Preliminary)
Multilayer Chip Couplers
ACX
Advanced Ceramic X
Features
Monolithic SMD with ultra-small, low-profiled, and light-weight
type.
Applications
0.4 ~ 6 GHz wireless communication systems, including
DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth
modules, etc.
Specifications
Part Number
Frequency
(MHz)
Insertion
Loss
(dB)
VSWR
Coupling
(dB)
Isolation
(dB)
CP1005-19C0897_ 880 ~ 915 0.25 max. 1.3 max. 18.5 1.0
Q’ty/Reel (pcs)
Operating Temperature Range
Storage Temperature Range
Storage Period
Power Capacity
: 10000
: -40 ~ +85 oC
: +5 ~ +35 oC, Humidity 45~75%RH
: 12 months max.
: 3W max.
Part Number
CP 1005 - 19 C
0897 /LF
33.0
Type
Coupling
Central Frequency
Soldering
CP : Coupler
Dimensions ( L × W ) 1.0 × 0.5 mm
19 : 18.5 dB
Specification Code
0897 : 897MHz Packaging
=lead-containing
/LF=lead-free
C
T: Tape & Reel
B: Bulk
CP1005-19C0897T/LF REV:2 PAGE:1/7
Terminal Configuration
ACX
Advanced Ceramic X
No. Terminal Name No. Terminal Name
Out Coupling
IN Termination
Dimensions and Recommended PC Board Pattern
W
a
L
b
Unit : mm
T
c
Mark
Dimensions
L
1.0
0.1
W
0.5
0.1
Ta
b
c
0.37
0.1
0.25
0.1
0.05 +0.1/-0.05 +0.1/-0.05 +0.1/-0.05
*
0.25
*0.25
0.35
* 0.4
*
Solder Resist
Land
Through-hole ( 0.3)
* Line width should be designed to match 50characteristic impedance, depending on PCB material and
thickness.
CP1005-19C0897T/LF REV:2 PAGE:2/7
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