파트넘버.co.kr 70ADH 데이터시트 PDF


70ADH 반도체 회로 부품 판매점

Modular Contact



Bourns 로고
Bourns
70ADH 데이터시트, 핀배열, 회로
Features
4 mm pitch
Rechargeable battery-pack applications
Precious metal contacts
Tape & reel available
RoHS compliant* - see processing
information on RoHS compliant surface
mount components
70AD/Female - Modular Contact
Materials & Finishes
Insulator Glass reinforced thermoplastic,
UL 94V-0 rated, black
Contact ...............................Copper alloy
Finish
Underplating....................... 30 μ” min. Ni
Contact Area ......... 30 μ” min. Au over Ni
T ermination.............................Tin alloy
(meets MIL-STD-202, method 208)
Operating Characteristics
Electrical
Current Rating.............DC 3 A/contact
Voltage Rating....................... DC 30 V
Contact Resistance ..........25 mΩ max.
Dielectric Voltage .................AC 500 V
Insulating Resistance ......500 MΩ min.
Operating Temperature
..................................-55 °C to 125 °C
Mechanical
Durability .........................5,000 cycles
How to Order
70AD J - 3 - F L 0 G
Model
Terminal Style
J = SMT
H = Through-hole
Number of Contacts
2 through 6
Gender
F = Female
Height
L = Low Profile
Options
0 = Standard
1 = Locator Pins (J style only)
Packaging Option
__ = Tube (240/N pcs. or 240 contacts
per tube)
G = Embossed Tape (500 pcs. per reel)
Number of
Contacts
2
3
4
5
6
Dim.
A
9.0
(.354)
13.0
(.512)
17.0
(.669)
21.0
(.827)
25.0
(.984)
Dim.
B
4.0
(.157)
8.0
(.315)
12.0
(.472)
16.0
(.630)
20.0
(.787)
Dim.
C
6.99
(.275)
11.0
(.433)
15.0
(.591)
19.0
(.748)
22.9
(.900)
Product Dimensions
70ADJ
4.0
(.157)
2.54
(.100)
70ADH
4.0
(.157)
11.0
(.433)
2.5
(.098)
6.02 11.0
(.237) (.433)
B
2.5
(.098)
A
B
2.5
(.098)
A
1.0
(.039)
C
0.36
(.014)
2.08
(.082)
4.48
(.176)
2.3
(.091)
0.76
(.030)
1.27 DIA.
(.050)
1.77
(.070)
0.7
(.028)
11.6
(.457)
15.0 REF
0.6
(.024)
3.8
(.150)
0.7
(.028)
11.6
1.0 (.457)
(.039)
0.6
(.024)
70ADJ RECOMMENDED PWB MOUNTING PATTERN
C
B
4.0
(.157)
4.04
(.159)
70ADH RECOMMENDED PWB MOUNTING PATTERN
4.0
(.157)
0.94
(.037)
DIA.
8 PLCS.
11.4
(.449)
1.65
(.065)
DIA.
1.3
(.051)
8 PLCS
10.08
(.397)
TOLERANCES:
±0.3
(±.012)
UNLESS OTHERWISE NOTED
D(IINMCEHNESSIO) NS: MM
2.8
(.110)
8 PLCS
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
http://www.Datasheet4U.com
Users should verify actual device performance in their specific applications.


70ADH 데이터시트, 핀배열, 회로
70AD/Female - Modular Contact
Packaging Specifications
2.6 ± 0.2
(.102 ± .008)
0.33 ± 0.3
(.013 ± .001)
A
4.0
(.157)
4.0
(.157)
2.0
(.079)
DIA.
1.50 +0.10/-0
(.059 +.004/-0)
1.75
(.069)
16.0
(.630)
11.5
(.453)
24.0 ± 0.3
(.945 ± .012)
1.5 +0.7/-0
(.059 +.028/-0)
DIA. MIN. HOLE
12.0
(.472)
2.8 ± 0.2
(.110 ± .008)
0.30 ± 0.06
(.012 ± .002)
25.5
(1.004) A
4.0
(.157)
4.0
(.157)
2.0
(.079)
1.50 +0.10/-0
(.059 +.004/-0)
DIA.
1.75
(.069)
20.20 ± 0.15
(.795 ± .006)
40.4
(1.591)
44.0 ± 0.03
(1.732 ± .001)
7.8
(.307)
12.0
(.472)
16.0
(.630)
2.0 +0.2/-0
(.079 +.008/-0)
DIA. MIN. HOLE
No. of
Contacts
2
3
4
Dimension
A
9.5
(.374)
13.5
(.531)
17.5
(.689)
No. of
Contacts
5
6
Dimension
A
19.5
(.768)
25.5
(1.004)
13.0 ± .204
(.512 ± .008)
DIA.
1.5
(.059)
MIN.
EQUALLY
SPACED
3 PLCS.
20.2
(.795)
DIA. MIN.
330.2
(13.00)
DIA. MAX.
DIA. MIN. ACCESS HOLE AT 40.0
SLOT LOCATION
(1.575)
99.1 ± 1.02
(3.90 ± .04)
No. of
Contacts
2
3
4
5
6
Dimension
A
24.41
(.961)
24.41
(.961)
24.41
(.961)
44.83
(1.765)
44.83
(1.765)
Dimension
B (Max.)
30.40
(1.197)
30.40
(1.197)
30.40
(1.197)
50.30
(1.98)
50.30
(1.98)
DIMENSIONS:
MM
(INCHES)
2.5
(.098)
MIN.
WIDTH
X
10.0
(.394)
MIN.
DEPTH
X
A
B MAX.
REV. 12/13
SLOT IN CORE
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.




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