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centralsemi |
PROCESS CPZ40X
Transient Voltage Suppressor
5 Volt TVS Chip
PROCESS DETAILS
Die Size
Die Thickness
Cathode Bonding Pad Area
Top Side Metalization
Back Side Metalization
13.4 x 13.4 MILS
5.5 MILS
3.9 x 6.7 MILS
Al - 30,000Å
Au - 9,000Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
122,493
PRINCIPAL DEVICE TYPE
CMO5V0LC
w w w. c e n t r a l s e m i . c o m
R0 (9-January 2013)
http://www.Datasheet4U.com
PROCESS CPZ40X
Typical Electrical Characteristics
w w w. c e n t r a l s e m i . c o m
R0 (9-January 2013)
http://www.Datasheet4U.com
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