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HSML-C170 반도체 회로 부품 판매점

(HSMx-C110 - HSMx-C191) High Performance ChipLED



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HSML-C170 데이터시트, 핀배열, 회로
HSMx-C110/C170/C190/C191/C150
High Performance ChipLED
Data Sheet
HSMA-C110/C170/C190/C191/C150
HSML-C110/C170/C190/C191/C150
HSMC-C110/C170/C190/C191/C150
HSMZ-C110/C170/C190
Description
These chip-type LEDs utilize Aluminum Indium Gal-
lium Phosphide (AlInGaP) material technology. The
AlInGaP material has a very high luminous efficiency,
capable of producing high light output over a wide
range of drive currents. The available colors in this
surface mount series are 592 nm Amber, 605 nm
Orange, 626 nm Red for AS AlInGaP and 631 nm red
for TS AlInGaP.
All packages are binned by both color and intensity,
except for red color.
Features
• High brightness AlInGaP material
• Small size
• Industry standard footprint
• Diffused optics
• Top emitting or right angle emitting
• Available in 3 colors (red, orange, amber)
• Compatible with IR soldering
• Available in 8 mm tape on 7" diameter reel
• Reel sealed in zip locked moisture barrier bags
These ChipLEDs come either in two top emitting
packages (HSMx-C170/C190/C191/C150) or in a side
emitting package (HSMx-C110). The right angle
ChipLEDs are suitable for applications such as LCD
backlighting. The top emitting ChipLEDs with wide
viewing angle are suitable for light piping and direct
backlighting of keypads and panels. In order to facili-
tate pick and place operation, these ChipLEDs are
shipped in tape and reel, with 4000 units per reel for
HSMx-C170/C190/C191 and 3000 units per reel for
HSMx-C110/C150.
Applications
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol indicator
• Microdisplays
• Small message panel signage
These packages are compatible with IR soldering
process.
Free Datasheet http://www.datasheet-pdf.com/


HSML-C170 데이터시트, 핀배열, 회로
Package Dimensions
LED DIE
CATHODE
LINE
1.0 (0.039)
CLEAR
EPOXY
PC BOARD
2.6 (0.102 )
3.2 (0.126 )
POLARITY
1.5 (0.059)
1.6 (0.063 )
3.2 (0.126 )
0.5 (0.020)
0.8 (0.031)
CATHODE LINE
1.0 (0.039)
SOLDERING
TERMINAL
HSMx-C110
LED DIE
CATHODE
MARK
1.25 (0.049)
2.0 (0.079 )
0.62 (0.024)
DIFFUSED
EPOXY
0.3 (0.012)
PC BOARD
1.4
(0.055)
CATHODE LINE
0.4 ± 0.15
(0.016 ± 0.006)
POLARITY
0.8 (0.031)
0.3 (0.012)
0.4 ± 0.15
(0.016 ± 0.006)
SOLDERING
TERMINAL
HSMx-C170
LED DIE
CATHODE
MARK
1.6
(0.063 )
0.8 (0.031)
0.4 (0.016)
0.3 (0.012)
DIFFUSED EPOXY
1.0
(0.039)
POLARITY
PC BOARD
CATHODE LINE
0.8 (0.031)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
LED DIE
CATHODE
MARK
1.6
(0.063 )
0.8 (0.031)
0.4 (0.016)
0.3 (0.012)
DIFFUSED EPOXY
1.0
(0.039)
POLARITY
PC BOARD
CATHODE LINE
0.6 (0.023)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
HSMx-C190
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2
SOLDERING
TERMINAL
HSMx-C191
Free Datasheet http://www.datasheet-pdf.com/




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(HSMx-C110 - HSMx-C191) High Performance ChipLED - Avago