파트넘버.co.kr B173RW01-V0 데이터시트 PDF


B173RW01-V0 반도체 회로 부품 판매점

Color TFT-LCD



AUO 로고
AUO
B173RW01-V0 데이터시트, 핀배열, 회로
www.DataSheet4U.net
Product Specification
AU OPTRONICS CORPORATION
( V ) Preliminary Specifications
( ) Final Specifications
Module
Model Name
Note ( )
17.3” HD+ Color TFT-LCD with LED Backlight design
B173RW01 V0 (H/W:0A)
LED Backlight with driving circuit design
Customer
Date
Approved by
Date
Checked &
Approved by
Date
Beyond Yang
Prepared by
09/03/2008
Karen CL Wu
09/03/2008
Note: This Specification is subject to change without
notice.
NBBU Marketing Division /
AU Optronics corporation
B173RW01 V0 Document Version : 0.1
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B173RW01-V0 데이터시트, 핀배열, 회로
www.DataSheet4U.net
Product Specification
AU OPTRONICS CORPORATION
Contents
1. Handling Precautions .............................................................. 4
2. General Description ................................................................ 5
2.1 General Specification ..........................................................................................................................5
2.2 Optical Characteristics ........................................................................................................................6
3. Functional Block Diagram ..................................................... 11
4. Absolute Maximum Ratings................................................... 12
4.1 Absolute Ratings of TFT LCD Module.............................................................................................12
4.2 Absolute Ratings of Environment .....................................................................................................12
5. Electrical characteristics ....................................................... 13
5.1 TFT LCD Module..............................................................................................................................13
5.2 Backlight Unit ...................................................................................................................................15
6. Signal Characteristic ............................................................. 16
6.1 Pixel Format Image ...........................................................................................................................16
6.2 The input data format ........................................................................................................................17
6.3 Integration Interface and Pin Assignment..........................................................................................18
6.4 Interface Timing ................................................................................................................................22
7. Connector Description........................................................... 25
7.1 TFT LCD Module..............................................................................................................................25
8. LED Driving Specification ...................................................... 26
8.1 Connector Description.......................................................................................................................26
8.2 Pin Assignment..................................................................................................................................26
9. Vibration and Shock Test ...................................................... 27
9.1 Vibration Test ....................................................................................................................................27
9.2 Shock Test Spec:................................................................................................................................27
10. Reliability............................................................................ 28
11. Mechanical Characteristics.................................................. 29
11.1 LCM Outline Dimension .................................................................................................................29
11.2 Screw Hole Depth and Center Position ...........................................................................................31
12. Shipping and Package ......................................................... 32
12.1 Shipping Label Format ....................................................................................................................32
12.2 Carton package ................................................................................................................................33
12.3 Shipping package of palletizing sequence.......................................................................................33
13. Appendix: EDID description ................................................ 34
B173RW01 V0 Document Version : 0.1
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