파트넘버.co.kr K51P81M100SF2 데이터시트 PDF


K51P81M100SF2 반도체 회로 부품 판매점

Up to 100 MHz ARM Cortex-M4 core



Freescale Semiconductor 로고
Freescale Semiconductor
K51P81M100SF2 데이터시트, 핀배열, 회로
www.DataSheet.co.kr
Freescale Semiconductor
Data Sheet: Product Preview
Document Number: K51P81M100SF2
Rev. 4, 3/2011
K51 Sub-Family Data Sheet
Supports the following:
MK51X256CLK100, MK51X256CMB100
Features
Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 85°C
Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 256 KB program flash memory on
FlexMemory devices
– Up to 256 KB FlexNVM on FlexMemory devices
– 4 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
K51P81M100SF2
Human-machine interface
– Segment LCD controller supporting up to 40
frontplanes and 8 backplanes, or 44 frontplanes and
4 backplanes
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
Analog modules
– Two 16-bit SAR ADCs
– Programmable gain amplifier (up to x64) integrated
into each ADC
– Two 12-bit DACs
– Two operational amplifiers
– Two transimpedance amplifiers
– Two analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
Communication interfaces
– USB full-/low-speed On-the-Go controller with on-
chip transceiver
– Two SPI modules
– Two I2C modules
– Four UART modules
– I2S module
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2011 Freescale Semiconductor, Inc.
Preliminary
Datasheet pdf - http://www.DataSheet4U.net/


K51P81M100SF2 데이터시트, 핀배열, 회로
www.DataSheet.co.kr
Table of Contents
1 Ordering parts...........................................................................4
6.1 Core modules....................................................................21
1.1 Determining valid orderable parts......................................4
6.1.1 Debug trace timing specifications.........................21
2 Part identification......................................................................4
6.1.2 JTAG electricals....................................................21
2.1 Description.........................................................................4
6.2 System modules................................................................25
2.2 Format...............................................................................4
6.3 Clock modules...................................................................25
2.3 Fields.................................................................................4
6.3.1 MCG specifications...............................................25
2.4 Example............................................................................5
6.3.2 Oscillator electrical specifications.........................27
3 Terminology and guidelines......................................................5
6.3.3 32kHz Oscillator Electrical Characteristics............29
3.1 Definition: Operating requirement......................................5
6.4 Memories and memory interfaces.....................................30
3.2 Definition: Operating behavior...........................................6
6.4.1 Flash (FTFL) electrical specifications....................30
3.3 Definition: Attribute............................................................6
6.4.2 EzPort Switching Specifications............................34
3.4 Definition: Rating...............................................................7
6.5 Security and integrity modules..........................................35
3.5 Result of exceeding a rating..............................................7
6.6 Analog...............................................................................35
3.6 Relationship between ratings and operating
6.6.1 ADC electrical specifications.................................36
requirements......................................................................7
6.6.2 CMP and 6-bit DAC electrical specifications.........43
3.7 Guidelines for ratings and operating requirements............8
6.6.3 12-bit DAC electrical characteristics.....................46
3.8 Definition: Typical value.....................................................8
6.6.4 Op-amp electrical specifications...........................49
3.9 Typical value conditions....................................................9
6.6.5 Transimpedance amplifier electrical
4 Ratings......................................................................................9
specifications — full range....................................50
4.1 Thermal handling ratings...................................................10
6.6.6 Transimpedance amplifier electrical
4.2 Moisture handling ratings..................................................10
specifications — limited range..............................51
4.3 ESD handling ratings.........................................................10
6.6.7 Voltage reference electrical specifications............52
4.4 Voltage and current operating ratings...............................10
6.7 Timers................................................................................53
5 General.....................................................................................11
6.8 Communication interfaces.................................................54
5.1 Nonswitching electrical specifications...............................11
6.8.1 USB electrical specifications.................................54
5.1.1 Voltage and current operating requirements.........11
6.8.2 USB DCD electrical specifications........................54
5.1.2 LVD and POR operating requirements.................12
6.8.3 USB VREG electrical specifications......................54
5.1.3 Voltage and current operating behaviors..............13
6.8.4 DSPI switching specifications (low-speed mode)..55
5.1.4 Power mode transition operating behaviors..........13
6.8.5 DSPI switching specifications (high-speed mode) 56
5.1.5 Power consumption operating behaviors..............14
6.8.6 I2C switching specifications..................................58
5.1.6 EMC radiated emissions operating behaviors.......17
6.8.7 UART switching specifications..............................58
5.1.7 Designing with radiated emissions in mind...........18
6.8.8 I2S switching specifications..................................58
5.1.8 Capacitance attributes..........................................18
6.9 Human-machine interfaces (HMI)......................................60
5.2 Switching specifications.....................................................18
6.9.1 TSI electrical specifications...................................60
5.2.1 Device clock specifications...................................18
6.9.2 LCD electrical characteristics................................61
5.2.2 General switching specifications...........................19
7 Dimensions...............................................................................62
5.3 Thermal specifications.......................................................20
7.1 Obtaining package dimensions.........................................62
5.3.1 Thermal operating requirements...........................20
8 Pinout........................................................................................63
5.3.2 Thermal attributes.................................................20
8.1 K51 Signal Multiplexing and Pin Assignments..................63
6 Peripheral operating requirements and behaviors....................20
8.2 K51 Pinouts.......................................................................67
K51 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
2
Preliminary
Freescale Semiconductor, Inc.
Datasheet pdf - http://www.DataSheet4U.net/




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K51P81M100SF2

Up to 100 MHz ARM Cortex-M4 core - Freescale Semiconductor