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PDF BD4912 Data sheet ( Hoja de datos )

Número de pieza BD4912
Descripción DMOS System Power Supply
Fabricantes ROHM Semiconductor 
Logotipo ROHM Semiconductor Logotipo



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TECHNICAL NOTE
System Power Supply LSI Series for Use inAutomotive Electronics
ESD
DMOS System Power Supply Resistance
Now available
ICs with low current consumption
BD4912/BD4912-V4
zDescription
The BD4912/BD4912-V4 provides multiple supply voltage outputs for use in car audio and satellite navigation systems with
CD player, radio, antenna, lighting, and other components. In addition to overcurrent, overvoltage, and thermal shutdown
circuits, it incorporates circuitry for reacting to sudden BATTERY power failures and is ideal for car audio and satellite
navigation systems. With its 110 µA (max.) standby current, the BD4912/BD4912-V4 delivers low current consumption when
the BATTERY is off.
zFeatures
1) Built-in power supplies for car audio and satellite navigation systems
5.0 V microcontroller power supply
8.12 V audio power supply
7.9 V radio power supply
10.3 V lighting power supply
1 VDD-linked high side switch
2 VCC-linked high side switches
2) Compatible with 0.1 µF output load ceramic capacitors. (Note: Select the adequate capacitance values for each
particular application)
3) The ability to operate VDD using the charge stored in a backup capacitor, prevents the IC from malfunctioning in the
event of a sudden BATTERY power failure.
4) Output pins use low-dropout P-channel POWER MOS FETs
5) Built-in overcurrent protection circuits
6) Built-in overvoltage protection circuits
7) Built-in thermal shutdown circuit
8) A 12-pin power package gives the IC large power dissipation capabilities and is ideal for space-saving designs.
z Applications
Car audio and satellite navigation systems
Ver.B Oct.2005
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BD4912 pdf
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60
30
From the left,
Ta=85
Ta=25
Ta=-40
0
10 100 1000 10000
FREQUENCY:f [Hz]
100000
Fig.11 AUDIO Ripple Rejection Ratio
(IO = 200 mA)
8.3
8.2
8.1
8.0
7.9
-60
-20 20
60
AMBIENT TEMPERATURE:Ta []
100
Fig.12 AUDIO Output Voltage vs
Temperature
15
From the left,
10
Ta=-40
Ta=85
Ta=25
5
0
0 200 400 600
OUTPUT CURRENT:Io [mA]
Fig.13 P.CON Load Regulation
0.6
Ta=85
0.4
Ta=25
0.2
Ta=-40
0
0 50 100 150 200 250 300 350
OUTPUT CURRENT:Io [mA]
Fig.14 P.CON Dropout Voltage
15
From the left,
Ta=-40
10 Ta=85
Ta=25
5
0
0 200 400 600 800
OUTPUT CURRENT:Io [mA]
Fig.15 P.ANT Load Regulation
0.5
Ta=85
0.4
0.3 Ta=25
0.2
0.1 Ta=-40
0
0 100 200 300
OUTPUT CURRENT:Io [mA]
Fig.16 P.ANT Dropout Voltage
10
8
6 From the left,
Ta=85
4
Ta=25
Ta=-40
2
0
0 10 20 30 40
SUPPLY VOLTAGE:Vcc1,2 [V]
Fig.17 AM Line Regulation
(IO = No load)
10
8
From the left,
Ta=-40
6 Ta=85
Ta=25
4
2
0
0 10 20 30 40 50
OUTPUT CURRENT:Io [mA]
Fig.18 AM Load Regulation
0.5
Ta=85
0.4
0.3 Ta=25
0.2
0.1
0
0
Ta=-40
5 10 15 20
OUTPUT CURRENT:Io [mA]
25
Fig.19 AM Dropout Voltage
(VCC1 = VCC2 = 7.5 V)
5/16
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zThermal design
50
40
37.5(1)
30
20 19.0(2)
(1) When using an infinite heat sink θj-c = 2.0
(°C/W)
(2) 100 × 100 × 2 (mm3) (when using an aluminum
heat sink)
(3) 50 × 50 × 2 (mm3) (when using an aluminum heat
sink)
(4) IC without heat sink operation.θj-a = 36.8 (°C /W)
Note: When using an aluminum heat sink, use a
tightening torque of 6 (Kg cm) and apply
silicon grease.
8.0(3)
10
3.4(4)
0 25 50 75 100 125 150
AMBIENT TEMPERATURE:Ta〔℃〕
Fig.46 Power Dissipation Characteristics
Refer to the heat reduction characteristics illustrated in Fig. 46 when using the IC in an environment where Ta 25°C. The
characteristics of the IC are greatly influenced by the operating temperature. If the temperature is in excess of the maximum
junction temperature Tjmax, the elements of the IC may be deteriorated or damaged. It is necessary to give sufficient
consideration to the heat of the IC in view of two points; First, the protection of the IC from instantaneous damage and second,
the maintenance of the reliability of the IC in long-time operation.
In order to protect the IC from thermal destruction, it is necessary to operate the IC below the maximum junction temperature
Tjmax. The chip's (junction area) temperature Tj may rise considerably even when the IC is being used at room temperature
(25°C). Always operate the IC within the power dissipation Pd.
Vcc
Vref
Load
Fig.47
The maximum power consumption PMAX (W) can be calculated as described below, where A denotes the
maximum VCC1 input voltage and B denotes the maximum VCC2 input voltage:
I1 = Max. VDD output current
I2 = Max. AUDIO output current
I3 = Max. P.CON output current
I4 = Max. P.ANT output current
I5 = Max. AM output current
I6 = Max. SW5V output current
I7 = Max. ILM output current
Power consumed by VDD
Power consumed by AUDIO
Power consumed by P.CON
Power consumed by P.ANT
Power consumed by AM
Power consumed by SW5V
Power consumed by ILM
Power consumed by each circuit's current
P1 = (B-5.0 V) × I1
P2 = (A-8.12 V) × I2
P3 = 0.7 V × I3
P4 = 0.7 V × I4
P5 = (A-7.9 V) × I5
P6 = 0.7 V × I6
P7 = (A-10.3 V) × I7
P8 = A × Circuit current (circuit current is approximately 2 mA)
PMAX = P1 + P2 + P3 + P4 + P5 + P6 + P7 + P8
11/16
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