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K20P100M100SF2 반도체 회로 부품 판매점

K20 Sub-Family



Freescale Semiconductor 로고
Freescale Semiconductor
K20P100M100SF2 데이터시트, 핀배열, 회로
www.DataSheet.co.kr
Freescale Semiconductor
Data Sheet: Product Preview
Document Number: K20P100M100SF2
Rev. 4, 3/2011
K20 Sub-Family Data Sheet
Supports the following:
MK20X256VLL100, MK20N512VLL100
Features
Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
K20P100M100SF2
Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
Analog modules
– Two 16-bit SAR ADCs
– Programmable gain amplifier (up to x64) integrated
into each ADC
– 12-bit DAC
– Three analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
Communication interfaces
– USB full-/low-speed On-the-Go controller with on-
chip transceiver
– Two Controller Area Network (CAN) modules
– Three SPI modules
– Two I2C modules
– Five UART modules
– Secure Digital host controller (SDHC)
– I2S module
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2011 Freescale Semiconductor, Inc.
Preliminary
Datasheet pdf - http://www.DataSheet4U.net/


K20P100M100SF2 데이터시트, 핀배열, 회로
www.DataSheet.co.kr
Table of Contents
1 Ordering parts...........................................................................3
6.1 Core modules....................................................................19
1.1 Determining valid orderable parts......................................3
6.1.1 Debug trace timing specifications.......................20
2 Part identification......................................................................3
6.1.2 JTAG electricals..................................................20
2.1 Description.........................................................................3
6.2 System modules................................................................23
2.2 Format...............................................................................3
6.3 Clock modules...................................................................23
2.3 Fields.................................................................................3
6.3.1 MCG specifications.............................................23
2.4 Example............................................................................4
6.3.2 Oscillator electrical specifications.......................26
3 Terminology and guidelines......................................................4
6.3.3 32kHz Oscillator Electrical Characteristics.........28
3.1 Definition: Operating requirement......................................4
6.4 Memories and memory interfaces.....................................28
3.2 Definition: Operating behavior...........................................5
6.4.1 Flash (FTFL) electrical specifications.................29
3.3 Definition: Attribute............................................................5
6.4.2 EzPort Switching Specifications.........................30
3.4 Definition: Rating...............................................................6
6.4.3 Flexbus Switching Specifications........................31
3.5 Result of exceeding a rating..............................................6
6.5 Security and integrity modules..........................................33
3.6 Relationship between ratings and operating
6.6 Analog...............................................................................33
requirements......................................................................6
6.6.1 ADC electrical specifications..............................33
3.7 Guidelines for ratings and operating requirements............7
6.6.2 CMP and 6-bit DAC electrical specifications......41
3.8 Definition: Typical value.....................................................7
6.6.3 12-bit DAC electrical characteristics...................44
3.9 Typical value conditions....................................................8
6.6.4 Voltage reference electrical specifications..........47
4 Ratings......................................................................................8
6.7 Timers................................................................................48
4.1 Thermal handling ratings...................................................9
6.8 Communication interfaces.................................................48
4.2 Moisture handling ratings..................................................9
6.8.1 USB electrical specifications...............................49
4.3 ESD handling ratings.........................................................9
6.8.2 USB DCD electrical specifications......................49
4.4 Voltage and current operating ratings...............................9
6.8.3 USB VREG electrical specifications...................49
5 General.....................................................................................10
6.8.4 CAN switching specifications..............................50
5.1 Nonswitching electrical specifications...............................10
6.8.5 DSPI switching specifications (low-speed
5.1.1 Voltage and current operating requirements......10
mode)..................................................................50
5.1.2 LVD and POR operating requirements...............11
6.8.6 DSPI switching specifications (high-speed
5.1.3 Voltage and current operating behaviors............12
mode)..................................................................51
5.1.4 Power mode transition operating behaviors.......12
6.8.7 I2C switching specifications................................53
5.1.5 Power consumption operating behaviors............13
6.8.8 UART switching specifications............................53
5.1.6 EMC radiated emissions operating behaviors....16
6.8.9 SDHC specifications...........................................53
5.1.7 Designing with radiated emissions in mind.........17
6.8.10 I2S switching specifications................................54
5.1.8 Capacitance attributes........................................17
6.9 Human-machine interfaces (HMI)......................................56
5.2 Switching specifications.....................................................17
6.9.1 TSI electrical specifications................................56
5.2.1 Device clock specifications.................................17
7 Dimensions...............................................................................57
5.2.2 General switching specifications.........................18
7.1 Obtaining package dimensions.........................................57
5.3 Thermal specifications.......................................................18
8 Pinout........................................................................................58
5.3.1 Thermal operating requirements.........................18
8.1 K20 Signal Multiplexing and Pin Assignments..................58
5.3.2 Thermal attributes...............................................19
8.2 K20 Pinouts.......................................................................62
6 Peripheral operating requirements and behaviors....................19
9 Revision History........................................................................63
K20 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
2
Preliminary
Freescale Semiconductor, Inc.
Datasheet pdf - http://www.DataSheet4U.net/




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