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Excelics Semiconductor |
Excelics
EIA1314A-4P
Not recommended for new designs. Contact factory. Effective 03/2003
13.0-14.5GHz, 4W Internally Matched Power FET
• 13.0-14.5GHz BANDWIDTH AND INPUT/OUTPUT
IMPEDANCE MATCHED TO 50 OHM
• FEATURES HIGH PAE (27% TYPICAL)
• +36.0dBm TYPICAL P1dB OUTPUT POWER
• 8.5dB TYPICAL G1dB POWER GAIN
• NON-HERMETIC METAL FLANGE PACKAGE
ELECTRICAL CHARACTERISTICS (Ta = 25 OC)
SYMBOLS
PARAMETERS/TEST CONDITIONS
P1dB
G1dB
PAE
Id1dB
IP3
Output Power at 1dB Compression f=13.0-14.5GHz
Vds=8V, Idsq=0.5 Idss
Gain at 1dB Compression
Vds=8V, Idsq=0.5 Idss
f=13.0-14.5GHz
Power Added Efficiency at 1dB compression
f=13.0-14.5GHz
Vds=8V, Idsq=0.5 Idss
Drain Current at 1dB Compression
Output 3rd Order Intercept Point f=13.0-14.5GHz
Vds=8V, Idsq=0.5 Idss
Idss Saturated Drain Current Vds=3V, Vgs=0V
Gm Transconductance Vds=3V, Vgs=0V
Vp Pinch-off Voltage Vds=3V, Ids=24mA
BVgd Drain Breakdown Voltage Igd=9.6mA
Rth Thermal Resistance (Au-Sn Eutectic Attach)
EIA1314A-4P
MIN TYP MAX
35.0 36.0
7.5 8.5
27
1760
43
2200 2880 3400
3000
-1.0 -2.5
-13 -15
4.5
UNIT
dBm
dB
%
mA
dBm
mA
mS
V
V
oC/W
MAXIMUM RATINGS AT 25OC
SYMBOLS
PARAMETERS
ABSOLUTE1
Vds Drain-Source Voltage
12V
Vgs Gate-Source Voltage
-8V
Ids Drain Current
Idss
Igsf Forward Gate Current
360mA
Pin Input Power
35dBm
Tch Channel Temperature
175oC
www.DataSheet4U.comTstg
Storage Temperature
-65/175oC
Pt Total Power Dissipation
30W
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
CONTINUOUS2
8V
-3V
3120mA
60mA
@ 3dB Compression
150oC
-65/150oC
25W
Excelics Semiconductor, Inc., 310 De Guine Drive, Sunnyvale, CA 94085
Phone: (408) 737-1711 Fax: (408) 737-1868 Web Site: www.excelics.com
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