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BD8918F 반도체 회로 부품 판매점

IC Care Interface ICs



ROHM Semiconductor 로고
ROHM Semiconductor
BD8918F 데이터시트, 핀배열, 회로
www.DataSheet4U.com
IC Card Interface ICs
IC Card Interface ICs
with Built-in Low Noise LDO Regulator
BD8918F,BD8918FV,BD8919F,BD8919FV
No.09056EDT01
Overview
This is an interface IC for a 5V smart card.
It works as a bidirectional signal buffer between a smart card and a controller. Also, it supplies 5V power to a smart card.
With an electrostatic breakdown voltage of more than HBM; ±6000V, it protects the card contact pins.
Features
1) 1 half duplex bidirectional buffers
2) Protection against short-circuit for all the card contact pins
3) 5V power source for the card (VCC)
4) Over-current protection for card power source
5) Built-in thermal shutdown circuit
6) Built-in supply voltage detector
7) Automatic activation/deactivation sequence function for card contact pin
Activation sequence: driven by a signal from controller (CMDVCCB)
Deactivation sequence: driven by a signal from controller (CMDVCCB) and fault detection (card removal, short
circuit of card power, IC overheat detection, VDD or VDDP drop)
8) Card contact pin ESD voltage ±6000V
9) Recommend frequency of crystal oscillator: 8MHz (BD8918F/FV), 16MHz (BD8919F/FV)
10) Programmable for card clock division of output signal: 1/1 and 1/2(BD8918F/FV), 1/2 and 1/4(BD8919F/FV).
11) RST output control by RSTIN input signal (positive output)
12) One multiplexed card status output by OFFB signal
Applications
Interface for CLASS A smart cards
Interface for B-CAS cards
Line up matrix
Part No
BD8918F
BD8918FV
BD8919F
BD8919FV
Card clock
Ratio of dividing frequency
1/1f, 1/2f
1/2f, 1/4f
Package
SOP16
SSOP-B16
SOP16
SSOP-B16
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
1/15
2010.4 - Rev.D


BD8918F 데이터시트, 핀배열, 회로
BD8918F,BD8918FV,BD8919F,BD8919FV
Absolute maximum ratings (Ta=25°C)
Parameter
Symbol
VDD Input Voltage
VDD
Ratings
-0.3 ~ 6.5
Unit
V
Technical Note
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Notes
VDDP Input Voltage
I/O Pin Voltage
Card Contact Pin Voltage
VDDP
VMIN
VMOUT
VCD
-0.3 ~ 6.5
-0.3 ~ +6.5
-0.3 ~ +6.5
V
V
Pin: XTAL1, XTAL2, CLKSEL, RSTIN, IO_U
CMDVCCB, OFFB
V Pin: PRES, CLK, RST, IO_C
Junction Temperature
Tjmax
+150
°C
Storage Temperature
Tstg
-55 ~ +150
Power Dissipation
Ptot
0.375 *1
0.500 *2
*1 BD8918F/BD8919F, *2 BD8918FV/BD8919FV
• This product is not designed to be radiation tolerant.
• Absolute maximum ratings are not meant for guarantee of operation.
°C
W
T = -20 ~ +85°C
(Refer to the following package power dissipation)
Operating Conditions (Ta=25°C)
Parameter
Symb
ol
VDD Input Voltage
VDDP Input Voltage
Operating Temperature
VDD
VDDP
Topr
Ratings
MIN TYP MAX
2.7 - 5.5
4.75 -
5.5
-40 - +85
Unit
V
V VCC 4.55V
°C
Notes
Package Power Dissipation
The power dissipation of a simple package in case of a boadless will be as follows.
Use of this device beyond the following the power dissipation may cause permanent damage.
BD8918F/BD8919F
BD8918FV/BD8919FV
Pd=375mW; however, reduce 3mW per 1°C when used at Ta 25°C.
Pd=500mW; however, reduce 4mW per 1°C when used at Ta 25°C.
Package power
0.4
Package power
0.6
0.5
0.3
0.4
0.2 0.3
0.2
0.1
0.1
0.0
0
25 50 75 100 125 150
Temp (℃)
Fig. 1.1 BD8918F/BD8919F Power Dissipation
0.0
0
25 50 75 100 125 150
Temp (℃)
Fig. 1.2 BD8918FV/BD8919FV Power Dissipation
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
2/15
2010.4 - Rev.D




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