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CHIP |
Product Brief
8-port Ethernet Over SDH Mapping Device
CP1158
OPTRANS Series
www.daOtasVheEet4Ru.cVomIEW
The CP1158 is one of the OPTRANS series chips designed by
Chiphomer Technology Limited. It is a highly integrated EOS
device that provides for mapping of 10/100/1000 Mbit/s Ethernet
into SDH STM-1 Transport payloads. The device supports
connection for up to eight 10/100 Mbit/s Ethernet ports, using
SMII or SS-SMII interface, or one 1000 Mbit/s Ethernet port,
using GMII interface. Ethernet frames are encapsulated using
either GFP or HDLC-like protocol. The encapsulated Ethernet
frames are then mapped into virtually concatenated VC-12, VC-3
or VC-4 payloads. Link Capacity Adjustment Scheme (LCAS) for
VC-12/VC-3/VC-4 virtual concatenation is provided to enable
hitless addition and removal of bandwidth under the control of a
network management system. The VC-12, VC-3 and VC-4 POH
generation and termination are performed. A byte-wide
19.44MHz Telecom Bus interface is provided for the SDH
interface.
PBGA352
PBGA352
-40 ~ 85 ℃
FEATURES
z Supports up to eight ports of full-duplex10/100 Mbit/s Ethernet or a single port of full-duplex 1000 Mbit/s
Ethernet with standards-compliant flow control supported:
10/100 Mbit/s Ethernet interface supports SMII and SS-SMII
1000 Mbit/s Ethernet interface supports GMII
Ethernet
Line
Side
8 x 10/100
or
1 x 1000
MDIO
MAC
IPBC
(Ingress Packet
Buffer Control)
EPBC
(Egress Packet
Buffer Control )
MP
(Microprocess Interface)
TENC
(Transmit
GFP/HDLC-like
Encapsulation)
RDEC
(Receive
GFP/HDLC-like
Decapsulation)
VC-12 POH VC-3 /VC-4 POH
Insertion Insertion
Telecom
Bus
Side
TVCP
(Transmit Virtual
Concatenation and
LCAS Processing)
RVCP
(Receive Virtual
Concatenation and
LCAS Processing)
Output bus
POH
(SDH LO/HO
Path Overhead
Processor)
Telecom Bus
Interface
Input bus
CP1158
DDR_CTL (DDR SDRAM controlller)
External DDR SDRAM
VC-12 POH VC-3/VC-4 POH
Extraction Extraction
Copyright ©2006 Chiphomer Technology Limited
Page 1 of 3
Product Brief
8-port Ethernet Over SDH Mapping Device
CP1158
OPTRANS Series
z Ethernet Management interface (MDIO) for control and configuration of external connected PHYs
www.daztasheePt4rou.vciodmes IEEE 802.3 Management Statistics (RMON)
z Supports multiple virtual concatenation groups from one Ethernet port based on VLAN tag identification
z Supports multiple virtual concatenation groups to one Ethernet port based on the user’s configuration
z Supports up to 16 virtual concatenation groups
z Supports up to four priority queues, enabling time-sensitive data to have access to the network with
minimal delay
z Provides RED algorithm for buffer management
z Provides per-priority scheduling using Round Robin mechanism
z Supports the following encapsulation/decapsulation protocols on a per port basis:
ITU-T G.7041, Generic Framing Procedure (GFP)
HDLC-like Framing, including the following protocols:
ITU-T X.86/X.85, Link Access Procedure SDH (LAPS)
RFC1662, Point-to-Point Protocol (PPP)
RFC3518, PPP Bridging Control Protocol (BCP)
z Supports the following SDH mapping formats:
C-12/VC-12/TU-12/TUG-2/TUG-3/VC-4/AU-4/STM-1
C-3/VC-3/TU-3/TUG-3/VC-4/AU-4/STM-1
C-4/VC-4/AU-4/STM-1
z Supports selection of VC-4, VC-3 or VC-12 virtual concatenation on a per virtual concatenation group
basis
z Supports hitless Link Capacity Adjustment Scheme (LCAS) (ITU-T G.7042)
z Supports up to 240ms (VC-12)/254ms (VC-3) of differential delay compensation
z Supports TU-12/TU-3 pointer interpretation
z Supports VC-12, VC-3 and VC-4 POH generation and termination
z Full access VC-12, VC-3 and VC-4 POH through external serial interface
z Provides byte-wide 19.44MHz Telecom Bus interface
z Controlled High-Z output on Output Telecom Bus
z Provides three bus timing modes for Output Telecom Bus
z Supports per-port Ethernet side and SDH system side loopbacks for system level diagnostics
z Provides 16-bit Intel/Motorola microprocessor interface
z Provides an IEEE 1149.1 compliant JTAG test port for boundary scan
z Operating Industrial temperature range: -40℃ ~ 85℃
z Low power 1.8V core with 3.3V LVTTL I/O, LVPECL I/O and 2.5V SSTL_2 digital I/O
z The maximum power consumption is 2.3W
z 27x27mm PBGA 352 package
APPLICATIONS
z SDH Add/Drop Multiplexers
z Multi-service Access Platform (MSAP)
z Test Equipment
SDH Terminal Multiplexers
Customer Premises Equipment (CPE) platform
Copyright ©2006 Chiphomer Technology Limited
Page 2 of 3
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