파트넘버.co.kr B57620 데이터시트 PDF


B57620 반도체 회로 부품 판매점

SMD NTC Thernistors



EPCOS 로고
EPCOS
B57620 데이터시트, 핀배열, 회로
Temperature Measurement
SMD NTC Thermistors with Silver Palladium Termination, Size 0805
B57620
C 620
Applications
I Temperature measurement and
compensation in
hybrid circuits
data systems
telecom systems
automotive electronics
Features
I Silver palladium termination (AgPd)
I Cost-effective
I Suitable for wave and reflow soldering
www.DataOShpetieotn4sU.com
Alternative resistance ratings and resistance tolerance
< 5% available on request
Delivery mode
Blister tape, 180-mm reel, PU: 4000 pcs
Climatic category (IEC 60068-1)
Max. power at 25 °C (on PCB)
Resistance tolerance
Rated temperature
B value tolerance
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
P25
RN/RN
TN
B/B
δth1)
τc1)
Cth1)
R25
220
330
470
680
1k
2,2 k
4,7 k
No. of R/T
characteristic
3207
3204
3205
3206
3206
1304
1010
B25/50
K
3060
3190
3270
3420
3420
3250
3470
B25/85
K
3090
3250
3290
3440
3440
3280
3510
+: J for RN/RN = ± 5 %
K for RN/RN = ± 10 %
M for RN/RN = ± 20 %
1) Depends on mounting situation
1,25±0,15
1,3 max.
Termination
Dimensions in mm
Approx. weight 13 mg
TNT0397-7-E
55/125/21
210 mW
± 5 %, ± 10 %, ± 20 %
25 °C
±3%
approx. 3,5
mW/K
approx. 10
s
approx. 35
mJ/K
B25/100
K
3100
3250
3300
3450
3450
3300
3530
Ordering code
B57620C0221+062
B57620C0331+062
B57620C0471+062
B57620C0681+062
B57620C0102+062
B57620C0222+062
B57620C0472+962
58 05/02


B57620 데이터시트, 핀배열, 회로
Temperature Measurement
SMD NTC Thermistors with Silver Palladium Termination, Size 0805
B57620
C 620
R25
10 k
22 k
47 k
100 k
220 k
No. of R/T
characteristic
1011
2003
2101
2903
2904
B25/50
K
3660
3930
4030
4120
4230
B25/85
K
3730
3960
4080
4190
4280
B25/100
K
3730
3980
4100
4200
4300
Ordering code
B57620C0103+062
B57620C0223+062
B57620C0473+062
B57620C0104+162
B57620C0224+062
+: J for RN/RN = ± 5 %
K for RN/RN = ± 10 %
M for RN/RN = ± 20 %
www.DataSheet4U.com
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Storage in
dry heat
Storage in damp
heat, steady state
Rapid temperature
cycling
Endurance
Solderability
Standard
IEC
60068-2-2
JIS C 0021
IEC
60068-2-3
JIS C 0022
IEC
60068-2-14
JIS C 0025
IEC
60068-2-58
JIS C 0054
Test conditions
R25/R25
(typical)
Storage at upper
category temperature
T: (125 ± 2) °C
t: 1000 h
< 3 %/
< 6 %1)
Temperature of air: (40 ± 2) °C
Relative humidity of air:
(93 +2/3) %
Duration: 21 days
<3%
Lower test temperature: 55 °C < 3 %
Upper test temperature: 125 °C
Number of cycles: 10
Pmax: 210 mW
T: (65 ± 2) °C
t: 1000 h
<5%
Solderability:
(215 ± 3) °C / (3 ± 0,3) s
(235 ± 5) °C / (2 ± 0,2) s
Remarks
No visible
damage
95 % of
terminations
wetted
Resistance drift
after soldering
Resistance to soldering heat:
(260 ± 5) °C / (10 ± 1) s
Reflow soldering profile
Wave soldering profile
<5%
1) The higher value applies to 220 1 ktypes.
59 05/02




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