PDF K8S6415ETB Data sheet ( Hoja de datos )

Número de pieza	K8S6415ETB
Descripción	(K8S6415ExB) 64M Bit Multi Bank NOR Flash Memory
Fabricantes	Samsung semiconductor
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No Preview Available ! K8S6415ET(B)B FLASH MEMORY Document Title 64M Bit (4M x16) Muxed Burst , Multi Bank NOR Flash Memory Revision History Revision No. History 0.0 Initial Issue Draft Date Remark October 20, 2004 1.0 Revision March 22, 2005 - Specification finalized - Add the requirement and note of Quadruple word program operation www.DataSheet4U.com 1.1 Bottom boot block description is added January 09,2006 1 Revision 1.1 January, 2006 1 page K8S6415ET(B)B Table 3. Block Address Table Bank Block BA134 BA133 BA132 BA131 BA130 BA129 BA128 Bank0 BA127 BA126 www.DataSheet4U.com BA125 BA124 BA123 BA122 BA121 BA120 BA119 BA118 BA117 Bank1 BA116 BA115 BA114 BA113 BA112 BA111 BA110 BA109 Bank2 BA108 BA107 BA106 BA105 BA104 BA103 BA102 BA101 Bank3 BA100 BA99 BA98 BA97 BA96 BA95 BA94 BA93 Bank4 BA92 BA91 BA90 BA89 BA88 Block Size 4 Kwords 4 Kwords 4 Kwords 4 Kwords 4 Kwords 4 Kwords 4 Kwords 4 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 32 Kwords 5 FLASH MEMORY (x16) Address Range 3FF000h-3FFFFFh 3FE000h-3FEFFFh 3FD000h-3FDFFFh 3FC000h-3FCFFFh 3FB000h-3FBFFFh 3FA000h-3FAFFFh 3F9000h-3F9FFFh 3F8000h-3F8FFFh 3F0000h-3F7FFFh 3E8000h-3EFFFFh 3E0000h-3E7FFFh 3D8000h-3DFFFFh 3D0000h-3D7FFFh 3C8000h-3CFFFFh 3C0000h-3C7FFFh 3B8000h-3BFFFFh 3B0000h-3B7FFFh 3A8000h-3AFFFFh 3A0000h-3A7FFFh 398000h-39FFFFh 390000h-397FFFh 388000h-38FFFFh 380000h-387FFFh 378000h-37FFFFh 370000h-377FFFh 368000h-36FFFFh 360000h-367FFFh 358000h-35FFFFh 350000h-357FFFh 348000h-34FFFFh 340000h-347FFFh 338000h-33FFFFh 330000h-337FFFh 328000h-32FFFFh 320000h-327FFFh 318000h-31FFFFh 310000h-317FFFh 308000h-30FFFFh 300000h-307FFFh 2F8000h-2FFFFFh 2F0000h-2F7FFFh 2E8000h-2EFFFFh 2E0000h-2E7FFFh 2D8000h-2DFFFFh 2D0000h-2D7FFFh 2C8000h-2CFFFFh 2C0000h-2C7FFFh Revision 1.1 January, 2006 5 Page K8S6415ET(B)B FLASH MEMORY DEVICE OPERATION The device has I/Os that accept both address and data information. To write a command or command sequence (which includes pro- gramming data to the device and erasing blocks of memory), the system must drive CLK, AVD and CE to VIL and OE to VIH when providing an address to the device, and drive CLK, WE and CE to VIL and OE to VIH when writing commands or data. The device provide the unlock bypass mode to save its program time for program operation. Unlike the standard program command sequence which is comprised of four bus cycles, only two program cycles are required to program a word in the unlock bypass mode. One block, multiple blocks, or the entire device can be erased. Table 3 indicates the address space that each block occupies. The device’s address space is divided into sixteen banks: Bank 0 contains the boot/parameter blocks, and the other banks(from Bank 1 to 15) consist of uniform blocks. A “bank address” is the address bits required to uniquely select a bank. Similarly, a “block address” is the address bits required to uniquely select a block. ICC2 in the DC Characteristics table represents the active current specification for the write mode. The AC Characteristics section contains timing specification tables and timing diagrams for write operations. Read Mode www.DataSheet4U.cTohme device automatically enters to asynchronous read mode after device power-up. No commands are required to retrieve data in asynchronous mode. After completing an Internal Program/Erase Routine, each bank is ready to read array data. The reset com- mand is required to return a bank to the read(or erase-suspend-read)mode if DQ5 goes high during an active program/erase opera- tion, or if the bank is in the autoselect mode. The synchronous(burst) mode will automatically be enabled on the first rising edge on the CLK input while AVD is held low. That means device enters burst read mode from asynchronous read mode to burst read mode using CLK and AVD signal. When the burst read is finished(or terminated), the device return to asynchronous read mode automatically. Asynchronous Read Mode For the asynchronous read mode a valid address should be asserted on A/DQ0-A/DQ15 and A16-A21, while driving AVD and CE to VIL. WE should remain at VIH . Note that CLK must remain low for asynchronous read mode. The address is latched at the rising edge of AVD, and then the system can drive OE to VIL. The data will appear on A/DQ0-A/DQ15. Since the memory array is divided into sixteen banks, each bank remains enabled for read access until the command register contents are altered. Address access time (tAA) is equal to the delay from valid addresses to valid output data. The chip enable access time(tCE) is the delay from the falling edge of CE to valid data at the outputs. The output enable access time(tOE) is the delay from the falling edge of OE to valid data at the output. The asynchronous access time is measured from a valid address, falling edge of AVD or falling edge of CE whichever occurs last. To prevent the memory content from spurious altering during power transition, the initial state machine is set for reading array data upon device power-up, or after a hardware reset. Synchronous (Burst) Read Mode The device is capable of continuous linear burst operation and linear burst operation of a preset length. For the burst mode, the sys- tem should determine how many clock cycles are desired for the initial word(tIAA) of each burst access and what mode of burst oper- ation is desired using "Burst Mode Configuration Register" command sequences. See "Set Burst Mode Configuration" for further details. The status data also can be read during burst read mode by using AVD signal with a bank address. To initiate the synchro- nous read again, a new address and AVD pulse is needed after the host has completed status reads or the device has completed the program or erase operation. Continuous Linear Burst Read The synchronous(burst) mode will automatically be enabled on the first rising edge on the CLK input while AVD is held low. Note that the device is enabled for asynchronous mode when it first powers up. The initial word is output tIAA after the rising edge of the first CLK cycle. Subsequent words are output tBA after the rising edge of each successive clock cycle, which automatically increments the internal address counter. Note that the device has internal address boundary that occurs every 16 words. When the device is cross- ing the first word boundary, additional clock cycles are needed before data appears for the next address. The number of addtional clock cycle can vary from zero to three cycles, and the exact number of additional clock cycle depends on the starting address of burst read.(Refer to Figure 13) The RDY output indicates this condition to the system by pulsing low. The device will continue to out- put sequential burst data, wrapping around to address 000000h after it reaches the highest addressable memory location until the system asserts CE high, RESET low or AVD low in conjunction with a new address.(See Table 4.) The reset command does not ter- minate the burst read operation. If the host system crosses the bank boundary while reading in burst mode, and the accessed bank is not programming or erasing, a additional clock cycles are needed as previously mentioned. If the host system crosses the bank boundary while the accessed bank is programming or erasing, that is busy bank, the synchronous read will be terminated. 11 Revision 1.1 January, 2006 11 Page

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