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Standard Microcircuit Drawing



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5962-87775 데이터시트, 핀배열, 회로
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REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
A Add device type 02. Technical changes to table 1. Editorial changes
throughout.
B Drawing updated to reflect current requirements. - gt.
81-09-30
04-06-18
APPROVED
N.A. Hauck
R. Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
REV
B
SHEET
1
PREPARED BY
Marcia B. Kelleher
B
2
CHECKED BY
Charles E. Besore
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
87-12-30
BBBBBBB
3456789
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, LINEAR, 5-VOLT POSITIVE
REGULATOR, MONOLITHIC SILICON
AMSC N/A
DSCC FORM 2233
APR 97
REVISION LEVEL
B
SIZE
A
SHEET
CAGE CODE
67268
1 OF 9
5962-87775
5962-E272-04


5962-87775 데이터시트, 핀배열, 회로
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1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87775
01
Y
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
Generic number
Circuit function
01
LM123K
5-volt positive regulator
02
LT123AK
5-volt positive regulator
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
Y
See figure 1
2
TO-3
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Input voltage (VIN) ..................................................................... 20 V dc
Storage temperature range ..................................................... -65°C to +150°C
Maximum power dissipation (PD) ............................................... Internally limited
Lead temperature (soldering, 10 seconds) ............................... +300°C
Thermal resistance, junction-to-case (θJC) ................................ 3°C/W 1/
Maximum output current (IMAX) ................................................ 3.0 A
1.4 Recommended operating conditions.
Ambient operating temperature range (TA)........................... -55°C to +125°C
1/ Without a heat sink, the thermal resistance of the TO-3 package is about 35°C/W. With a heat sink, the effective
thermal resistance can only approach the value of 2°C/W, depending on the efficiency of the heat sink.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
B
5962-87775
SHEET
2




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Standard Microcircuit Drawing - ETC