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Intel |
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Intel® Advanced Boot Block Flash
Memory (B3)
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Datasheet
Product Features
• Flexible SmartVoltage Technology
— 2.7 V – 3.6 V read/program/erase
— 12 V VPP fast production programming
• 1.65 V – .5 V or 2.7 V – 3.6 V I/O option
— Reduces overall system power
• High Performance
— 2.7 V – 3.6 V: 70 ns max access time
• Optimized Block Sizes
— Eight 8-KB blocks for data, top or
bottom locations
— Up to 127 x 64-KB blocks for code
• Block Locking
— VCC-level control through Write Protect
WP#
• Low Power Consumption
— 9 mA typical read current
• Absolute Hardware-Protection
— VPP = GND option
— VCC lockout voltage
• Extended Temperature Operation
— –40 °C to +85 °C
• Automated Program and Block Erase
— Status registers
• Intel® Flash Data Integrator Software
—Flash Memory Manager
—System Interrupt Manager
—Supports parameter storage, streaming
data (for example, voice)
• Extended Cycling Capability
—Minimum 100,000 block erase cycles
• Automatic Power Savings Feature
—Typical ICCS after bus inactivity
• Standard Surface Mount Packaging
—48-Ball CSP packages
—40-Lead and 48-Lead TSOP packages
• Density and Footprint Upgradeable for
common package
—8-, 16-, 32-, and 64-Mbit densities
• ETOX™ VIII (0.13 µm) Flash
Technology
—16-Mbit and 32-Mbit densities
• ETOX™ VII (0.18 µm) Flash Technology
—16-, 32-, and 64-Mbit densities
• ETOX ™ VI (0.25µm) Flash Technology
—8-, 16-, and 32-Mbit densities
• Bo not use the x8 option for new designs
The Intel® Advanced Boot Block Flash Memory (B3) device, manufactured on the Intel 0.13 µm
and 0.18 µm technologies, is a feature-rich solution at a low system cost. The B3 device in x16 is
available in 48-lead TSOP and 48-ball CSP packages. The x8 option of this product family is
available only in 40-lead TSOP and 48-ball µBGA* packages. For additional information about
this product family, see the Intel website: http://www.intel.com/design/flash.
Notice: This specification is subject to change without notice. Verify with your local Intel sales
office that you have the latest datasheet before finalizing a design.
Order Number: 290580, Revision: 020
18 Aug 2005
www.DataSheet4U.com
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The Intel® Advanced Boot Block Flash Memory (B3) may contain design defects or errors known as errata which may cause the product to deviate
from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800
548-4725 or by visiting Intel's website at http://www.intel.com.
Intel, the Intel logo, and ETOX are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2005, Intel Corporation.
18 Aug 2005
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Intel® Advanced Boot Block Flash Memory (B3)
Order Number: 290580, Revision: 020
Datasheet
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