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PDF 84-1LMISR4 Data sheet ( Hoja de datos )
| Número de pieza | 84-1LMISR4 | |
| Descripción | ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE | |
| Fabricantes | ETC | |
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TECHNICAL DATASHEET
ABLEBOND® 84-1LMISR4
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION
ABLEBOND® 84-1LMISR4 electrically conductive die
attach adhesive has been formulated for use in high
throughput, automatic die attach equipment. The rhe-
ology of ABLEBOND 84-1LMISR4 adhesive allows
minimum adhesive dispense and die put down dwell
times, without tailing or stringing problems. The unique
combination of adhesive properties makes this material
one the most widely used die attach materials in the
semiconductor industry.
FEATURES
• Excellent dispensability with minimal tailing and stringing
• Box oven cure
Typical Uncured Properties
Filler Type
ABLEBOND 84-1LMISR4
Silver
Test Description
Test
Method
Viscosity @ 25ºC
8000 cP
Brookfield CP51 @ 5 rpm
ATM-0018
Thixotropic Index
www.DataSheet4U.com Work Life @ 25ºC
5.6
18 hours
Viscosity @ 0.5/Viscosity @ 5 rpm
Physical worklife by % filler
ATM-0089
ATM-0067
Storage Life @ -40ºC
Cure Process Data
Weight Loss on Cure
1 year
ABLEBOND 84-1LMISR4
Test Description
5.3%
10 x 10 mm Si die on glass slide
ATM-0068
Test
Method
ATM-0031
Recommended Cure Condition
1 hour @ 175ºC
Alternate Cure Condition (1)
3 - 5ºC / min ramp to 175ºC + 1 hour @ 175ºC
(1) The ramp was observed to yield reduced bondline voiding and increased strength
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary
based on customers’ experience and their application requirements, as well as customer curing equipment, oven
loading and actual oven temperatures.
PHYSIOCHEMICAL PROPERTIES
- Post Cure
Ionics
Chloride
Sodium
Potassium
Water Extract Conductivity
ABLEBOND 84-1LMISR4
Test Description
< 20 ppm
< 10 ppm
< 10 ppm
13 µmhos/cm
Teflon flask, 5 gm sample/20-40
mesh, 50 gm DI water, 100ºC for
24 hours
Conductometer
Test
Method
ATM-0007
ATM-0044
pH
6 pH meter
ATM-0002
Weight Loss @ 300ºC
0.35%
Thermogravimetric analysis
ATM-0073
The figures shown above are typical values only. If you need to write a specification, please request our current
Standard Release Specification.
07/05
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