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EPCOS |
SMT Inductors, SIMID Series
SIMID 1210-A
Size 1210 (EIA) or 3225 (IEC)
Rated inductance 0,0082 to 100 µH
Rated current 65 to 700 mA
Construction
s Ceramic or ferrite core
s US-welded winding
s Flame-retardant encapsulation
Features
s High Q factor
s High resonance frequency
s Suitable for reflow (IR and vapor phase)
and wave soldering
Applications
s Filtering of supply voltages, coupling, decoupling
s Antenna systems
s Automotive electronics
s Telecommunications
www.DataSheet4U.com
Terminals
s Silver-plated
s 1–2 µm Cu, 4–6 µm Ag
s Base material CuSn6
s Suitable for soldering and conductive adhesion
s No leaching during wave soldering
Marking
Marking on component:
Manufacturer and series mark »–«
L value (in nH) and tolerance of L value (coded),
date of manufacture (coded)
Minimum data on reel:
Manufacturer, part number, ordering code,
L value and tolerance of L value,
quantity, date of packing
Delivery mode
8-mm blister tape, wound on 180-mm or 330-mm ∅ reel
For details on taping, packing and packing units see page 153
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B82422-A
SMT Inductors, SIMID Series
SIMID 1210-A
General technical data
Rated inductance LR
Q factor Qmin
Rated current IR
Self-resonance frequency fres, min
DC resistance Rmax
Climatic category
Solderability
Resistance to soldering heat
Permissible PCB bending
Weight
B82422-A
Measured with impedance analyzer HP 4194A
at frequency fL
Measured with impedance analyzer
HP 4194A/HP 4291A at frequency fQ
Maximum permissible dc with
inductance decrease ∆L /L0 ≤ 10 %
and temperature increase of ≤ 20 K
at rated temperature of 85°C
Measured with network analyzer HP 8753
Measured at 20°C ambient temperature,
measuring current < IR
In accordance with IEC 60068-1
55/125/56 (– 55°C/+ 125°C/56 days damp heat test)
In accordance with IEC 60062-2-58
(215 ± 3)°C, (3 ± 0,3) s
Wetting of soldering area: ≥ 95 %
In accordance with IEC 60068-2-20
260°C, 10 s
∆L/L ≤ ± 3 %
2 mm (100 mm long standard PCB)
Approx. 50 mg
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