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PDF LC0404FCxxC Data sheet ( Hoja de datos )
| Número de pieza | LC0404FCxxC | |
| Descripción | LOW CAPACITANCE FLIP CHIP ARRAY | |
| Fabricantes | Protek Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de LC0404FCxxC (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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Only One Name Means ProTek’Tion™
LC0404FC3.3C
thru
LC0404FC36C
LOW CAPACITANCE FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones
✔ Personal Digital Assistant (PDA)
✔ Notebook Computers
✔ SMART Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Voltages Ranging From 3.3V to 36V
✔ 200 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Low Clamping Voltage
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 1 to 3 Lines
✔ LOW CAPACITANCE
✔ LOW LEAKAGE CURRENT
✔ RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0404
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Tin-Lead or Lead-Free Plating
✔ Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)
0404
(Single Chip Shown)
PIN CONFIGURATION
05157.R6 4/05
1 www.protekdevices.com
1 page  
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
TOP
F
END
E
H
I
LC0404FC3.3C
thru
LC0404FC36C
PACKAGE DIMENSIONS
DIM MILLIMETERS
INCHES
A 0.56 NOM 0.022 NOM
B 0.86 NOM 0.034 NOM
C
1.0 ± 0.02
0.039 ± 0.001
E 0.15 SQ
0.006 SQ
F
1.0 ± 0.0254
0.039 ± 0.001
G 0.15 NOM 0.006 NOM
H 0.127 MAX 0.005 MAX
0.076 MIN
0.003 MIN
I
0.406 NOM
0.016 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
MOUNTING PAD LAYOUT - Option 1
CA
DIE
SOLDER
BUMP
I
PAD DIMENSIONS
DIM MILLIMETERS
A 0.51
C 0.30
D 0.46
E 0.20
F 0.15 SQ
G 0.71
H 0.99
I 0.51
INCHES
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
NOTE:
1. Preferred: Using 0.1mm (0.004”) stencil.
SOLDER PRINT
0.010” - 0.012” DIA.
SOLDER PADS
SOLDER MASK
Outline & Dimensions: Rev4 - 9/04, 06022
05157.R6 4/05
5 www.protekdevices.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet LC0404FCxxC.PDF ] | |
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