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PDF QFP-SD Data sheet ( Hoja de datos )
| Número de pieza | QFP-SD | |
| Descripción | Stacked Die Quad Flat Pack | |
| Fabricantes | STATS ChipPAC | |
| Logotipo |  |
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QFP-SD
Stacked Die Quad Flat Pack
• Stacking of die enables more functionality and
integration in a conventional QFP package
FEATURES
• Combining devices into one package reduces PCB real
estate and cost
• Increased sub-system performance by integrating
multiple chips into a single package
• Die to die bonding capability for device/signal
integration
• Standard and green/lead-free materials and Pb-free
plating
• Options for mixed technologies, 2 or more stacked dice
• Fine pitch bonding capability
• Exposed pad provides enhanced thermal performance
• Low profile package thickness of 1.40mm (LQFP-SD and
LQFP-ep-SD); 1.00mm (TQFP-ep-SD)
• Lead pitch ranges from 0.80mm to 0.40mm
• Pin count ranges from 32 to 208 leads (LQFP-SD), 64 to
216 leads (LQFP-ep-SD), 32 to 100 leads (TQFP-ep-SD)
• JEDEC standard compliant package outlines
DESCRIPTION
STATS ChipPAC’s Stacked Die QFP offering includes LQFP-
SD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die
low profile QFP. LQFP-ep-SD is an exposed pad version that
provides enhanced thermal performance. TQFP-ep-SD is a
thin profile exposed pad version with enhanced thermal
performance. STATS ChipPAC’s chip stacking technology
allows the integration of multiple ICs within a single
package to improve package performance and functionality
while reducing overall package size and cost. The die to die
wire bonding capability enables device/signal integration
to improve electrical performance and reduce overall
package I/O requirements. STATS ChipPAC’s Stacked Die
QFPs with nominal package thickness of 1.40mm and
1.00mm are suitable for a variety of product applications.
Stacked Die QFP packages are currently available in LQFP,
LQFP-ep and TQFP-ep configurations, and are offered in
standard and green/lead-free bill of materials.
APPLICATIONS
Suitable for a variety of applications including memory
integration (ASIC or Logic), chipset integration (Analog/
Digital), mixed technologies integration (Baseband/RF),
handheld products (Cellular Phones, Pagers, MP3 Players,
GPS), consumer electronics (Internet applications, Digital
Cameras/Camcorders), computers (Network PCs), and PC
peripherals (Disk Drivers, CD-R/RW, DVD Drivers).
DataSheet4 U .com www.statschippac.com
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| PDF Descargar | [ Datasheet QFP-SD.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| QFP-SD | Stacked Die Quad Flat Pack | STATS ChipPAC |
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