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Fairchild Semiconductor |
PHOTODARLINGTON
OPTICAL INTERRUPTER SWITCH
H22B4
PACKAGE DIMENSIONS
0.472 (12.0)
0.457 (11.6)
CL
0.249 (6.35)
0.243 (6.15)
+
E
.133 (3.38)
.073 (1.85)
D
CL
+
0.39 (1.00)
0.34 (0.85)
0.129 (3.3)
0.119 (3.0)
0.433 (11.0)
0.422 (10.7)
Optical
CL
0.125 (3.2)
0.119 (3.0)
.295 (7.5)
.272 (6.9)
CL
.315 (8.00)
0.110 (2.8)
0.091 (2.3)
23
14
PIN 1 ANODE
PIN 2 CATHODE
PIN 3 COLLECTOR
PIN 4 EMITTER
0.020 (0.51) (SQ)
NOTES:
1. Dimensions for all drawings are in inches (mm).
2. Tolerance of ± .010 (.25) on all non-nominal dimensions unless
otherwise specified.
H22B5
H22B6
SCHEMATIC
4
1
23
DESCRIPTION
The H22B4, H22B5 and H22B6 consist of a gallium arsenide infrared emitting diode coupled with a silicon photodarlington in a
plastic housing. The packaging system is designed to optimize the mechanical resolution, coupling efficiency, ambient light rejec-
tion, cost and reliability. The gap in the housing provides a means of interrupting the signal with an opaque material, switching the
output from an “ON” to an “OFF” state.
FEATURES
• Opaque housing
• Low cost
• 035" apertures
• High IC(ON)
© 2002 Fairchild Semiconductor Corporation
Page 1 of 6
6/13/02
PHOTODARLINGTON
OPTICAL INTERRUPTER SWITCH
H22B4
H22B5
H22B6
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Symbol
Rating
Operating Temperature
Storage Temperature
Soldering Temperature (Iron)(2,3 and 4)
Soldering Temperature (Flow)(2 and 3)
INPUT (EMITTER)
Continuous Forward Current
Reverse Voltage
Power Dissipation(1)
OUTPUT (SENSOR)
Collector to Emitter Voltage
Emitter to Collector Voltage
Collector Current
Power Dissipation (TC = 25°C)(1)
TOPR
TSTG
TSOL-I
TSOL-F
IF
VR
PD
VCEO
VECO
IC
PD
-55 to +100
-55 to +100
240 for 5 sec
260 for 10 sec
50
6
100
55
6
40
150
NOTES:
1. Derate power dissipation linearly 1.33 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16" (1.6 mm) minimum from housing.
Unit
°C
°C
°C
°C
mA
V
mW
V
V
mA
mW
© 2002 Fairchild Semiconductor Corporation
Page 2 of 6
6/13/02
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