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PDF NJD2873T4 Data sheet ( Hoja de datos )
| Número de pieza | NJD2873T4 | |
| Descripción | NPN Silicon DPAK For Surface Mount Applications | |
| Fabricantes | ON Semiconductor | |
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NJD2873T4
Plastic Power Transistors
NPN Silicon DPAK For Surface Mount
Applications
Designed for high−gain audio amplifier applications.
Features
• Pb−Free Package is Available
• High DC Current Gain −
hFE = 120 (Min) @ IC = 500 mA
= 40 (Min) @ IC = 2 A
• Low Collector−Emitter Saturation Voltage −
VCE(sat) = 0.3 Vdc (Max) @ IC = 1 A
• High Current−Gain − Bandwidth Product −
fT = 65 MHz (Min) @ IC = 100 mA
• Epoxy Meets UL 94 V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Collector−Base Voltage
Collector−Emitter Voltage
Emitter−Base Voltage
Collector Current
Continuous
Peak
VCB
VCEO
VEB
IC
Dat5a0Sheet4VUdc.com
50 Vdc
5 Vdc
2 Adc
3
Base Current
Total Device Dissipation @ TC = 25°C
Derate above 25°C
IB 0.4 Adc
PD 12.5 W
0.1 W/°C
Total Device Dissipation @ TA = 25°C*
Derate above 25°C
PD 1.4 W
0.011
W/°C
Operating and Storage Junction
Temperature Range
TJ, Tstg
−65 to
+150
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol Max
Unit
Thermal Resistance Junction−to−Case RqJC
Junction−to−Ambient* RqJA
10 °C/W
89.3
*These ratings are applicable when surface mounted on the minimum pad sizes
recommended.
http://onsemi.com
SILICON
POWER TRANSISTORS
2 AMPERES
50 VOLTS
12.5 WATTS
4
DPAK
12
3
CASE 369C
STYLE 1
MARKING
DIAGRAM
YWW
J
2873
Y = Year
WW = Work Week
ORDERING INFORMATION
Device
Package
Shipping†
NJD2873T4
DPAK
2500 Units / Reel
NJD2873T4G
DPAK
(Pb−Free)
2500 Units / Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DataShee
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© Semiconductor Components Industries, LLC, 2004
August, 2004 − Rev. 3
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1 Publication Order Number:
NJD2873T4/D
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1 page  
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NJD2873T4
PACKAGE DIMENSIONS
et4U.com
DPAK
CASE 369C−01
ISSUE O
B
VR
−T−
SEATING
PLANE
C
E
S
F
4
1 23
A
K
J
LH
D 2 PL
G 0.13 (0.005) M T
U
Z
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.235 0.245
B 0.250 0.265
C 0.086 0.094
D 0.027 0.035
E 0.018 0.023
F 0.037 0.045
G 0.180 BSC
H 0.034 0.040
J 0.018 0.023
K 0.102 0.114
L 0.090 BSC
R 0.180 0.215
S 0.025 0.040
U 0.020 −−−
V 0.035 0.050
Z 0.155 −−−
MILLIMETERS
MIN MAX
5.97 6.22
6.35 6.73
2.19 2.38
0.69 0.88
0.46 0.58
0.94 1.14
4.58 BSC
0.87 1.01
0.46 0.58
2.60 2.89
2.29 BSC
4.57 5.45
0.63 1.01
0.51 −−−
0.89 1.27
3.93 −−−
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
SOLDERING FOOTPRINT*
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6.20 3.0
0.244
0.118
2.58
0.101
5.80
0.228
1.6 6.172
0.063 0.243
ǒ ǓSCALE 3:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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