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Reliability Qualification Report
STQ-2016Z - Matte Sn, RoHS compliant
Products Qualified by Similarity
STQ-1016Z SRF-1016Z SRQ-2116Z
STQ-3016Z SRF-2016Z
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for
inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this information, and all such information shall
be entirely at the user’s own risk. Data subject to change.
303 S. Technology Ct, Broomfield CO, 80021
Phone: (800) SMI-MMIC
http://www.sirenza.com
Document RQR-104756 Rev. B
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STQ-2016Z Reliability Qualification Report
I. Qualification Overview
The STQ-2016Z family of products has demonstrated reliable operation by passing all
qualification testing in Sirenza Microdevices' product qualification test plan. The
STQ-2016Z has been subject to stresses such as humidity (autoclave), extreme hot and
cold environments (temperature cycling), moisture sensitivity (MSL-1 and solder reflow
testing), and several others as part of the qualification process.
II. Introduction
The Sirenza Microdevices’ STQ-2016Z is a direct quadrature modulator targeted for use
in a wide range of communications systems, including cellular/PCS, CDMA2000, UMTS,
and ISM data com. This device features a wide 700-2500 MHz operating frequency
band, excellent carrier and sideband suppression, and a low broadband noise floor.
III. Fabrication Technology
These amplifiers are manufactured using a Silicon Germanium Heterojunction Bipolar
Transistor (HBT) technology. This patented self-aligned emitter, double poly HBT
process has been in production by our foundry since 1998. The process has been
successfully used for a wide range of RFIC products including GSM PAs, DECT front
end transceivers, LNAs & VCOs. This process offers comparable performance to GaAs
HBTs with the added advantages of mature and highly reproducible Silicon wafer
processing.
IV. Package Type
The STQ-2016Z is packaged in a plastic encapsulated TSSOP-16 package that is
assembled using a highly reproducible automated assembly process. The die is mounted
using an industry standard thermally and electrically conductive silver epoxy. The die is
mounted directly to the exposed paddle to provide a low thermal resistance path for heat
conduction out of the package.
Figure 1 : Image of TSSOP -16 Exposed Paddle Plastic Package
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