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TE28F032B3xxx 반도체 회로 부품 판매점

(TE28F Series) SMART 3 ADVANCED BOOT BLOCK 4-8-16-32-MBIT FLASH MEMORY FAMILY



Intel 로고
Intel
TE28F032B3xxx 데이터시트, 핀배열, 회로
E
PRELIMINARY
SMART 3 ADVANCED BOOT BLOCK
4-, 8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F400B3, 28F800B3, 28F160B3, 28F320B3
28F008B3, 28F016B3, 28F032B3
n Flexible SmartVoltage Technology
2.7 V–3.6 V Read/Program/Erase
12 V VPP Fast Production
Programming
n 2.7 V or 1.65 V I/O Option
Reduces Overall System Power
n High Performance
2.7 V–3.6 V: 90 ns Max Access Time
3.0 V–3.6 V: 80 ns Max Access Time
n Optimized Block Sizes
Eight 8-KB Blocks for Data,
Top or Bottom Locations
Up to Sixty-Three 64-KB Blocks for
Code
n Block Locking
VCC-Level Control through WP#
n Low Power Consumption
10 mA Typical Read Current
n Absolute Hardware-Protection
VPP = GND Option
VCC Lockout Voltage
n Extended Temperature Operation
–40 °C to +85 °C
n Flash Data Integrator Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., Voice)
n Automated Program and Block Erase
Status Registers
n Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles Guaranteed
n Automatic Power Savings Feature
Typical ICCS after Bus Inactivity
n Standard Surface Mount Packaging
48-Ball µBGA* Package
48-Lead TSOP Package
40-Lead TSOP Package
n Footprint Upgradeable
Upgrade Path for 4-, 8-, 16-, and 32-
Mbit Densities
n ETOX™ VI (0.25 µ) Flash Technology
The Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and
interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single
device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective,
monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40-
lead and 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be
obtained by accessing Intel’s WWW page: http://www.intel.com/design/flash.
July 1998
Order Number: 290580-005


TE28F032B3xxx 데이터시트, 핀배열, 회로
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of
Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life
saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The 28F400B3, 28F800/008B3, 28F160/016B3, 38F320/032B3 may contain design defects or errors known as errata which
may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call 1-800-548-4725
or visit Intel’s Website at http://www.intel.com
COPYRIGHT © INTEL CORPORATION 1996, 1997,1998
*Third-party brands and names are the property of their respective owners
CG-041493




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TE28F032B3xxx

(TE28F Series) SMART 3 ADVANCED BOOT BLOCK 4-8-16-32-MBIT FLASH MEMORY FAMILY - Intel