파트넘버.co.kr TE28F008B3T120 데이터시트 PDF


TE28F008B3T120 반도체 회로 부품 판매점

SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE



Intel Corporation 로고
Intel Corporation
TE28F008B3T120 데이터시트, 핀배열, 회로
E
PRELIMINARY
SMART 3 ADVANCED BOOT BLOCK
BYTE-WIDE
8-MBIT (1024K x 8), 16-MBIT (2056K x 8)
FLASH MEMORY FAMILY
28F008B3, 28F016B3
n Flexible SmartVoltage Technology
2.7V–3.6V Program/Erase
2.7V–3.6V Read Operation
12V VPP Fast Production
Programming
n 2.7V or 1.8V I/O Option
Reduces Overall System Power
n Optimized Block Sizes
Eight 8-Kbyte Blocks for Data,
Top or Bottom Locations
Up to Thirty-One 64-Kbyte Blocks
for Code
n High Performance
2.7V–3.6V: 120 ns Max Access Time
n Block Locking
VCC-Level Control through WP#
n Low Power Consumption
20 mA Maximum Read Current
n Absolute Hardware-Protection
VPP = GND Option
VCC Lockout Voltage
n Extended Temperature Operation
–40°C to +85°C
n Supports Code plus Data Storage
Optimized for FDI, Flash Data
Integrator Software
Fast Program Suspend Capability
Fast Erase Suspend Capability
n Extended Cycling Capability
10,000 Block Erase Cycles
n Automated Byte Program and Block
Erase
Command User Interface
Status Registers
n SRAM-Compatible Write Interface
n Automatic Power Savings Feature
n Reset/Deep Power-Down
1 µA ICCTypical
Spurious Write Lockout
n Standard Surface Mount Packaging
48-Ball µBGA* Package
40-Lead TSOP Package
n Footprint Upgradeable
Upgradeable from 2-, 4- and 8-Mbit
Boot Block
n ETOX™ V (0.4 µ) Flash Technology
n x8-Only Input/Output Architecture
For Space-Constrained 8-bit
Applications
The new Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.4µ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and
interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device.
Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective,
monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Byte-Wide
products will be available in 40-lead TSOP and 48-ball µBGA* packages. Additional information on this
product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp
May 1997
Order Number: 290605-001


TE28F008B3T120 데이터시트, 핀배열, 회로
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of
Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life
saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The 28F008B3 and 28F016B3 may contain design defects or errors known as errata which may cause the product to deviate
from published specifications. Current characterized errata are available on request.
*Third-party brands and names are the property of their respective owners.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 7641
Mt. Prospect, IL 60056-7641
or call 1-800-879-4683
or visit Intel’s website at http:\\www.intel.com
COPYRIGHT © INTEL CORPORATION 1996, 1997
*Third-party brands and names are the property of their respective owners.
CG-041493




PDF 파일 내의 페이지 : 총 30 페이지

제조업체: Intel Corporation

( intel )

TE28F008B3T120 data

데이터시트 다운로드
:

[ TE28F008B3T120.PDF ]

[ TE28F008B3T120 다른 제조사 검색 ]




국내 전력반도체 판매점


상호 : 아이지 인터내셔날

전화번호 : 051-319-2877

[ 홈페이지 ]

IGBT, TR 모듈, SCR, 다이오드모듈, 각종 전력 휴즈

( IYXS, Powerex, Toshiba, Fuji, Bussmann, Eaton )

전력반도체 문의 : 010-3582-2743



일반적인 전자부품 판매점


디바이스마트

IC114

엘레파츠

ICbanQ

Mouser Electronics

DigiKey Electronics

Element14


관련 데이터시트


TE28F008B3T120

SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE - Intel Corporation