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PDF BDW24 Data sheet ( Hoja de datos )
| Número de pieza | BDW24 | |
| Descripción | PNP SILICON POWER DARLINGTONS | |
| Fabricantes | Power Innovations Limited | |
| Logotipo |  |
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 1. 45V, PNP Transistor - Fairchild  Hay una vista previa y un enlace de descarga de BDW24 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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Copyright © 1997, Power Innovations Limited, UK
BDW24, BDW24A, BDW24B, BDW24C
PNP SILICON POWER DARLINGTONS
MAY 1989 - REVISED MARCH 1997
q Designed for Complementary Use with
BDW23, BDW23A, BDW23B and BDW23C
q 50 W at 25°C Case Temperature
q 6 A Continuous Collector Current
q Minimum hFE of 750 at 2 A, 3 V
B
C
E
TO-220 PACKAGE
(TOP VIEW)
1
2
3
Pin 2 is in electrical contact with the mounting base.
MDTRACA
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
Collector-base voltage (IE = 0)
RATING
Collector-emitter voltage (IB = 0)
Emitter-base voltage
Continuous collector current
Continuous base current
Continuous device dissipation at (or below) 25°C case temperature (see Note 1)
Continuous device dissipation at (or below) 25°C free air temperature (see Note 2)
Operating junction temperature range
Storage temperature range
Operating free-air temperature range
BDW24
BDW24A
BDW24B
BDW24C
BDW24
BDW24A
BDW24B
BDW24C
NOTES: 1. Derate linearly to 150°C case temperature at the rate of 0.4 W/°C.
2. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.
SYMBOL
VCBO
VCEO
VEBO
IC
IB
Ptot
Ptot
Tj
Tstg
TA
VALUE
-45
-60
-80
-100
-45
-60
-80
-100
-5
-6
-0.2
50
2
-65 to +150
-65 to +150
-65 to +150
UNIT
V
V
V
A
A
W
W
°C
°C
°C
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
1 page  
BDW24, BDW24A, BDW24B, BDW24C
PNP SILICON POWER DARLINGTONS
MAY 1989 - REVISED MARCH 1997
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO220
ø
3,96
3,71
see Note B
10,4
10,0
2,95
2,54
4,70
4,20
1,32
1,23
6,6
6,0
15,90
14,55
see Note C
6,1
3,5
0,97
0,61
123
1,70
1,07
2,74
2,34
5,28
4,88
14,1
12,7
0,64
0,41
2,90
2,40
VERSION 1
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTES: A. The centre pin is in electrical contact with the mounting tab.
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
Version 1, 18.0 mm. Version 2, 17.6 mm.
VERSION 2
PRODUCT INFORMATION
MDXXBE
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet BDW24.PDF ] | |
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