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PDF BD899 Data sheet ( Hoja de datos )
| Número de pieza | BD899 | |
| Descripción | NPN SILICON POWER DARLINGTONS | |
| Fabricantes | Power Innovations Limited | |
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Hay una vista previa y un enlace de descarga de BD899 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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Copyright © 1997, Power Innovations Limited, UK
BD895, BD897, BD899, BD901
NPN SILICON POWER DARLINGTONS
AUGUST 1993 - REVISED MARCH 1997
q Designed for Complementary Use with
BD896, BD898, BD900 and BD902
q 70 W at 25°C Case Temperature
q 8 A Continuous Collector Current
q Minimum hFE of 750 at 3V, 3A
TO-220 PACKAGE
(TOP VIEW)
B1
C2
E3
Pin 2 is in electrical contact with the mounting base.
MDTRACA
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
Collector-base voltage (IE = 0)
RATING
Collector-emitter voltage (IB = 0)
Base-emitter voltage
Continuous collector current
Continuous base current
Continuous device dissipation at (or below) 25°C case temperature (see Note 1)
Continuous device dissipation at (or below) 25°C free air temperature (see Note 2)
Operating free-air temperature range
Operating junction temperature range
Storage temperature range
BD895
BD897
BD899
BD901
BD895
BD897
BD899
BD901
NOTES: 1. Derate linearly to 150°C case temperature at the rate of 0.56 W/°C.
2. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.
SYMBOL
VCBO
VCEO
VEBO
IC
IB
Ptot
Ptot
TA
Tj
Tstg
VALUE
45
60
80
100
45
60
80
100
5
8
0.3
70
2
-65 to +150
-65 to +150
-65 to +150
UNIT
V
V
V
A
A
W
W
°C
°C
°C
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
1 page  
BD895, BD897, BD899, BD901
NPN SILICON POWER DARLINGTONS
AUGUST 1993 - REVISED MARCH 1997
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO220
ø
3,96
3,71
see Note B
10,4
10,0
2,95
2,54
4,70
4,20
1,32
1,23
6,6
6,0
15,90
14,55
see Note C
6,1
3,5
0,97
0,61
123
1,70
1,07
2,74
2,34
5,28
4,88
14,1
12,7
0,64
0,41
2,90
2,40
VERSION 1
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTES: A. The centre pin is in electrical contact with the mounting tab.
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
Version 1, 18.0 mm. Version 2, 17.6 mm.
VERSION 2
PRODUCT INFORMATION
MDXXBE
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet BD899.PDF ] | |
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