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FAST BOOT BLOCK FLASH MEMORY



Intel 로고
Intel
28F160F3 데이터시트, 핀배열, 회로
E
PRODUCT PREVIEW
FAST BOOT BLOCK
FLASH MEMORY FAMILY
8 AND 16 MBIT
28F800F3, 28F160F3
Includes Extended and Automotive Temperature Specifications
n High Performance
54 MHz Effective Zero Wait-State
Performance
Synchronous Burst-Mode Reads
Asynchronous Page-Mode Reads
n SmartVoltage Technology
2.7 V3.6 V Read and Write
Operations for Low Power Designs
12 V VPP Fast Factory Programming
n Flexible I/O Voltage
1.65 V I/O Reduces Overall System
Power Consumption
5 V-Safe I/O Enables Interfacing to
5 V Devices
n Enhanced Data Protection
Absolute Write Protection with
VPP = GND
Block Locking
Block Erase/Program Lockout
during Power Transitions
n Density Upgrade Path
8- and 16-Mbit
n Manufactured on ETOX™ V Flash
Technology
n Supports Code Plus Data Storage
Optimized for Flash Data Integrator
(FDI) Software
Fast Program Suspend Capability
Fast Erase Suspend Capability
n Flexible Blocking Architecture
Eight 4-Kword Blocks for Data
32-Kword Main Blocks for Code
Top or Bottom Configurations
Available
n Extended Cycling Capability
Minimum 10,000 Block Erase Cycles
Guaranteed
n Low Power Consumption
Automatic Power Savings Mode
Decreases Power Consumption
n Automated Program and Block Erase
Algorithms
Command User Interface for
Automation
Status Register for System
Feedback
n Industry-Standard Packaging
56-Lead SSOP
µBGA* CSP
Intel’s Fast Boot Block memory family renders high performance asynchronous page-mode and synchronous
burst reads making it an ideal memory solution for burst CPUs. Combining high read performance with the
intrinsic non-volatility of flash memory, this flash memory family eliminates the traditional redundant memory
paradigm of shadowing code from a slow nonvolatile storage source to a faster execution memory for
improved system performance. Therefore, it reduces the total memory requirement which helps increase
reliability and reduce overall system power consumption and cost.
This family of products is manufactured on Intel’s 0.4 µm ETOX™ V process technology. They are available
in industry-standard packages: the µBGA* CSP, ideal for board-constrained applications, and the rugged
56-lead SSOP.
May 1998
Order Number: 290644-001


28F160F3 데이터시트, 핀배열, 회로
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of
Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life
saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The 28F800F3, 28F160F3 may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call 1-800-548-4725
or visit Intel’s Website at http://www.intel.com
COPYRIGHT © INTEL CORPORATION, 1998
*Third-party brands and names are the property of their respective owners
CG-041493




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