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Intersil Corporation |
Data Sheet
3A Integrated Digital DC-DC Converter
Description
The ZL2105 is an innovative power conversion and
management IC that combines an integrated
synchronous step-down DC-DC converter with key
power management functions in a small package,
resulting in a flexible and integrated solution.
Zilker Labs Digital-DC™ technology enables
unparalleled power management integration while
delivering industry-leading performance in a tiny
footprint.
The ZL2105 can provide an output voltage from
0.6 V to 5.5 V from an input voltage between 4.5 V
and 14 V. Internal 4.5 A low RDS(ON) synchronous
power MOSFETs enable the ZL2105 to deliver
continuous loads up to 3 A with high efficiency,
and an internal Schottky bootstrap diode further
reduces discrete component count. The ZL2105
also supports phase spreading for reduced system
capacitance.
Power management features such as digital soft-
start delay and ramp, sequencing, tracking, and
margining can be configured by simple pin-
strapping or through an on-chip serial port. The
ZL2105 uses standard PMBus™ protocol for
communicating with other devices to provide
intelligent system power management.
ZL2105
www.DataSheet4U.com
February 18, 2009
FN6851.0
Features
Power Conversion
High efficiency
3 A continuous output current
Integrated MOSFET switches
4.5 V to 14 V input range
0.54 V to 5.5 V output range (with margin)
±1% output voltage accuracy
200 kHz to 2 MHz switching frequency
Supports phase spreading
Small footprint (6 x 6 mm QFN package)
Power Management
Digital soft start/stop
Precision delay and ramp-up
Power good/enable
Voltage tracking, sequencing, and margining
Output voltage/current monitoring
Thermal monitor w/ shutdown
Non-volatile memory
I2C/SMBus™ communication bus
PMBus compatible
Applications
Telecom and storage equipment
Digital set-top box
Industrial supplies
12 V distributed power systems
Point of load converters
Figure 1. Block Diagram
1 1-888-INTERSIL or 1-888-468-3774|Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners
ZL2105
Table of Contents
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1. Electrical Characteristics ...............................................................................................................................................3
2. Pin Descriptions ............................................................................................................................................................6
3. Typical Application Circuit...........................................................................................................................................8
4. ZL2105 Overview .......................................................................................................................................................10
4.1 Digital-DC Architecture........................................................................................................................................10
4.2 Power Conversion Overview ................................................................................................................................11
4.3 Power Management Overview..............................................................................................................................12
4.4 Multi-mode Pins....................................................................................................................................................12
5. Power Conversion Functional Description..................................................................................................................13
5.1 Internal Bias Regulators and Input Supply Connections ......................................................................................13
5.2 High-side Driver Boost Circuit .............................................................................................................................13
5.3 Low-side Driver Supply Options ..........................................................................................................................13
5.4 Dual Input Supply Configuration..........................................................................................................................14
5.5 Output voltage Selection .......................................................................................................................................15
5.6 Start-up Procedure.................................................................................................................................................15
5.7 Soft Start Delay and Ramp Times.........................................................................................................................16
5.8 Switching Frequency and PLL..............................................................................................................................17
5.9 Component Selection ............................................................................................................................................19
5.10 Current Sensing and Current Limit Threshold Selection ....................................................................................22
5.11 Loop Compensation ............................................................................................................................................22
5.12 Non-linear Response (NLR) Settings..................................................................................................................23
5.13 Efficiency Optimized Drive Dead-time Control .................................................................................................24
6. Power Management Functional Description ...............................................................................................................24
6.1 Input Undervoltage Lockout .................................................................................................................................24
6.2 Power Good (PG) and Output Overvoltage Protection.........................................................................................25
6.3 Output Overvoltage Protection .............................................................................................................................25
6.4 Output Pre-Bias Protection ...................................................................................................................................25
6.5 Output Overcurrent Protection..............................................................................................................................26
6.6 Thermal Overload Protection................................................................................................................................26
6.7 Voltage Tracking...................................................................................................................................................27
6.8 Voltage Margining ................................................................................................................................................28
6.9 I2C/SMBus Communications ................................................................................................................................29
6.10 I2C/SMBus Device Address Selection ................................................................................................................29
6.11 Phase Spreading ..................................................................................................................................................29
6.12 Output Sequencing..............................................................................................................................................30
6.13 Monitoring via I2C/SMBus .................................................................................................................................31
6.14 Temperature Monitoring using the XTEMP Pin.................................................................................................31
6.15 Non-Volatile Memory and Device Security Features .........................................................................................32
7. Package Dimensions....................................................................................................................................................33
8. Ordering Information ..................................................................................................................................................34
9. Related Documentation ...............................................................................................................................................34
10. Revision History........................................................................................................................................................35
2 Data Sheet Revision 2/18/2009
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