PDF AD9002 Data sheet ( Hoja de datos )

Número de pieza	AD9002
Descripción	High Speed 8-Bit Monolithic A/D Converter
Fabricantes	Analog Devices
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No Preview Available ! a High Speed 8-Bit Monolithic A/D Converter AD9002 FEATURES 150 MSPS ENCODE Rate Low Input Capacitance: 17 pF Low Power: 750 mW –5.2 V Single Supply MIL-STD-883 Compliant Versions Available APPLICATIONS Radar Systems Digital Oscilloscopes/ATE Equipment Laser/Radar Warning Receivers Digital Radio Electronic Warfare (ECM, ECCM, ESM) Communication/Signal Intelligence GENERAL DESCRIPTION The AD9002 is an 8-bit, high speed, analog-to-digital converter. The AD9002 is fabricated in an advanced bipolar process that allows operation at sampling rates in excess of 150 MSPS. Func- tionally, the AD9002 is comprised of 256 parallel comparator stages whose outputs are decoded to drive the ECL compatible output latches. An exceptionally wide, large signal, analog input bandwidth of 160 MHz is due to an innovative comparator design and very close attention to device layout considerations. The wide input bandwidth of the AD9002 allows very accurate acquisition of high speed pulse inputs without an external track-and-hold. The comparator output decoding scheme minimizes false codes, which is critical to high speed linearity. The AD9002 provides an external hysteresis control pin that can be used to optimize comparator sensitivity to further improve performance. Additionally, the AD9002’s low power dissipation of 750 mW makes it usable over the full extended temperature range. The AD9002 also incorporates an overflow bit to indicate overrange inputs. This overflow output can be disabled with the overflow inhibit pin. FUNCTIONAL BLOCK DIAGRAM OVERFLOW INH ANALOG IN +VREF REFMID –VREF ENCODE ENCODE AD9002 R 256 OVERFLOW R 255 BIT 8 (MSB) D E BIT 7 RC 128 O DL BIT 6 IA R/2 NT GC BIT 5 H R/2 L 127 O BIT 4 G I R C BIT 3 2 BIT 2 R 1 BIT 1 (LSB) GND HYSTERESIS –VS The AD9002 is available in two grades, one with 0.5 LSB linearity and one with 0.75 LSB linearity. Both versions are offered in an industrial grade, –25°C to +85°C, packaged in a 28-lead DIP and a 28-leaded JLCC. The military temperature range devices, –55°C to +125°C, are available in a ceramic DIP package and complies with MIL-STD-883 Class B. REV. G Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2003 Analog Devices, Inc. All rights reserved. 1 page ANALOG INPUT ENCODE OUTPUT DATA N APERTURE DELAY N+1 t PD N–1 N Figure 1. Timing Diagram N+2 N+1 AD9002 AD9002 ENCODE ENCODE –5.2V ANALOG INPUT AD9002 +VREF R –5.2V R/2 REFMID –5.2V R/2 R –5.2V –5.2V COMPARATOR CELLS –VREF Figure 2. Input/Output Circuits AD9002 DIGITAL OUTPUT 0.1␮F –5.2V AD1 AD2 AD3 –2V 100⍀ 1k⍀ 1k⍀ 0.1␮F –VS HYSTERESIS OVERFLOW OVERFLOW INH D8 ANALOG IN ENCODE ENCODE D7 D6 D5 –VREF +VREF AD9002 D4 D3 D2 GROUND D1 1k⍀ 1k⍀ 1k⍀ 1k⍀ 1k⍀ 1k⍀ 1k⍀ 1k⍀ 1k⍀ STATIC BURN IN AD1 = 0V AD2 = ECL HIGH DYNAMIC BURN IN AD1 AD2 AD3 ALL RESISTORS ؎5% ALL CAPACITORS ؎20% ALL SUPPLIES ؎5% AD3 = ECL LOW 0V –2V ECL HIGH ECL LOW ECL HIGH ECL LOW Figure 3. Burn-In Diagram REV. G OVERFLOW INH HYSTERESIS DIGITAL GROUND DIGITAL –VS OVERFLOW +VREF ANALOG INPUT ANALOG GROUND ENCODE ENCODE ANALOG GROUND ANALOG INPUT D8 (MSB) D7 D6 DIGITAL GROUND ANALOG –VS DIGITAL GROUND D5 D4 –VREF DIGITAL D1 (LSB) GROUND DIGITAL REFMID –VS D2 D3 Figure 4. Die Layout and Mechanical Information Die Dimensions . . . . . 106 mils × 114 mils × 15 mils (± 2 mils) Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 4 mils × 4 mils Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Nitride Die Attach . . . . . . . . . . . . . . . . . . . . . Gold Eutectic (Ceramic) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Epoxy (Plastic) Bond Wire . . . . . . . . . . 1 mil–1.3 mil Gold; Gold Ball Bonding –5– 5 Page

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