|
|
PDF BH2715FV Data sheet ( Hoja de datos )
| Número de pieza | BH2715FV | |
| Descripción | Successive Approximation A/D Converter | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de BH2715FV (archivo pdf) en la parte inferior de esta página. Total 18 Páginas | ||
|
No Preview Available !
Datasheet
A/D Converter Series
Successive Approximation A/D Converter
10bit, 50k to 220kSPS, 2.7 to 5.25V,
8-channel, SPITM Interface
BH2715FV
General Description
The BH2715FV is a general purpose, 10-bit 8-channel
successive approximation A/D converter. The sampling
rate of BH2715FV ranges from 50kSPS to 220kSPS.
Features
Successive Approximation A/D Converter with a
Built-in Track/Hold Circuit
8 Input Channels
Separate Analog and Digital Power Supplies
Serial Interface Compatible with
SPITM/DSPTM/MICROWIRETM
Low Power Consumption
Power Down Mode
Key Specifications
Supply Voltage Range:
2.7V to 5.25V
Resolution:
10bit
INL:
±1.5 LSB
DNL:
±1.2 LSB
Sampling Rate:
220kSPS(Max)
Power Consumption
In 220kSPS Operation: 1.2mW at VDD=3V(Typ)
6.5mW at VDD=5V(Typ)
Supply Current In Power Down:
0µA (Typ)
Operational Temperature Range: -40°C to +85°C
Package
SSOP-B16
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.40mm x 1.35mm
Applications
Sensors / Scanners
Battery Monitors and Power Supply Monitors
Control of the Various Types of FA Equipment
Typical Application Circuit
SSOP-B16
Vconv
LDO
0.1μF
LDO
0.1μF
RIN
CIN
AVDD
DVDD
INx CSB
BH2715FV
SCLK
SDIN
SDOUT
AGND
DGND
MICROPROCESSOR
or
DSP
RPD
〇Product structure : Silicon monolithic integrated circuit
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
〇This product has no designed protection against radioactive rays
1/14
TSZ02201-0RCR1N300010-1-2
25.Feb.2016 Rev.002
1 page  
BH2715FV
Electrical Characteristics
(Unless otherwise specified, VDD=2.7 to 5.25V, fSCLK=0.8 to 3.52MHz, fSAMPLE=50 to 220kSPS, CL=10pF, TA=-25 to +85°C,
Typical values are at VDD=5V and TA=25°C)
Parameter
Symbol
Min
Limits
Typ
Max
Unit
Condition
<Static Converter Characteristics>
Resolution with No missing codes
RES
10
-
- Bits TA=25°C
Integral Non-Linearity
INL -1.5
-
+1.5
LSB TA=25°C, End point method
Differential Non-Linearity
DNL
-1.2
-
+1.2
LSB TA=25°C
Offset Error
ZE -1 - +1 LSB TA=25°C
Full Scale Error
FSE -1 - +1 LSB TA=25°C
<Analog Input Characteristics>
Input Voltage Range
Input DC Leakage Current
VIN 0 - VA V
ILEAK
-1
-
+1 µA
Input Capacitance
CINA
-
32
-
pF In the Track mode
<Digital Input Characteristics>
High Input Voltage1
VIH1
2.1
-
-
V VDD=2.7 to 3.6V
High Input Voltage2
VIH2
2.4
-
-
V VDD=4.75 to 5.25V
Low Input Voltage
VIL -
- 0.8 V
Input Current
IIND -1 - +1 µA
<Digital Output Characteristics>
Output High Voltage
VOH VD-0.5
-
-
V IL=200µA
Output Low Voltage
VOL -
- 0.4 V IL=-1.0mA
Leakage current
in the high-impedance state
IOZ -1 - +1 µA
Output Coding
Straight Binary
<Power Supply Characteristics>
Supply Current (Operational)
Supply Current (Power Down)
<AC characteristic>
IDD1
-
1.3
2.1
mA
VDD=5.25V, VIN=VDD/2,
fSAMPLE=220kSPS
IDD2
-
0.4
0.94
mA
VDD=3.6V, VIN=VDD/2,
fSAMPLE=220kSPS
IPD1 -1
0
+1
µA
VDD=5.25V, VIN=GND,
fSAMPLE=0SPS, fSCLK=0Hz
IPD2 -1
0
+1
µA
VDD=5.25V, VIN=GND,
fSAMPLE=0SPS, fSCLK=0Hz
Clock Frequency
fSCLK
0.8
-
3.52 MHz
Sample Rate
fSAMPLE
50
-
220 kSPS
Conversion Time
Clock Duty Cycle
tCONVERT
-
13
- SCLK
DC 40 - 60 %
Acquisition Time
tACQ
-
3
- SCLK
Throughput Time
tTP - 16 - SCLK
Timing Specifications
(Unless otherwise specified, VDD=2.7 to 5.25V, fSCLK=0.8 to 3.52MHz, fSAMPLE=50 to 220kSPS, CL=10pF, TA=25°C)
Parameter
Symbol
Limits
Min Typ Max
Unit
Condition
CSB Setup Time
tCS 10 -
- ns
DOUT Access Time
tDACC
-
- 27 ns
DIN Setup Time
DIN Hold Time
tDS 10 -
tDH 10 -
- ns
- ns
DOUT Enable Time
tEN - - 30 ns
DOUT Disable Time
tDIS - - 20 ns
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/14
TSZ02201-0RCR1N300010-1-2
25.Feb.2016 Rev.002
5 Page 
BH2715FV
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/14
TSZ02201-0RCR1N300010-1-2
25.Feb.2016 Rev.002
11 Page | ||
| Páginas | Total 18 Páginas | |
| PDF Descargar | [ Datasheet BH2715FV.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| BH2715FV | Successive Approximation A/D Converter | ROHM Semiconductor |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |