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PDF BH2226F Data sheet ( Hoja de datos )
| Número de pieza | BH2226F | |
| Descripción | D/A Converters | |
| Fabricantes | ROHM Semiconductor | |
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Datasheet
D/A Converters
Standard 8bit 8ch Type
BH2226FV BH2226F
General Description
The BH2226FV,BH2226F is an 8bit R-2R-type D/A
converter with 8 channels. The D/A converter output
and serial/parallel conversion function can be switched
with one command, and a built-in RESET function
ensures that the output voltage at all channels is LOW
during power up. A broad power supply voltage range
(2.7V-5.5V) is available, providing design flexibility.
Features
■ Integrated expansion port function
■ Built-in RESET function
■ High speed output response characteristics
■ 3-line serial interface
Key Specifications
Power Source Voltage Range:
Number of Channels:
Current Consumption:
Differential Non Linearity Error:
Integral Non Linearity Error:
Output Current Performance:
Settling Time:
Data Transfer Frequency:
Input Method:
Data Latch Method:
Operating Temperature Range:
2.7V to 5.5V
8ch
1.1mA(Typ)
±1.0LSB
±1.5LSB
±1.0mA
100µs(Min)
10MHz(Max)
CMOS
CSB method
-20°C to +85°C
Packages
W(Typ) x D(Typ) x H(Max)
Applications
DVCs, DSCs, DVDs, CD-Rs, CD-RWs
SSOP-B16
5.00mm x 6.40mm x 1.35mm
Lineup
Package
SSOP-B16
Reel of 2500
SOP16
Reel of 2500
Orderable Part Number
BH2226FV-E2
BH2226F-E2
SOP16
10.00mm x 6.20mm x 1.71mm
○Product structure：Silicon monolithic integrated circuit
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product has no designed protection against radioactive rays
1/16
TSZ02201-0M2M0GZ15070-1-2
06.Nov.2015 Rev.001
1 page  
BH2226FV BH2226F
Typical Performance Curves
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
85°C
25°C
-20°C
123 456
SUSPuPppLlYy VVoOltaLgTeA: VGCEC :[VV]CC[V]
Figure 3. Circuit Current vs Supply Voltage
(Active Current Consumption)
3.0
VCC=3.0V
2.5
2.0
1.5
1.0
0.5
0.0
0
64 128 192
INIPnpUuTt CCodOeD[dEec:[]dec]
256
Figure 5. Output Voltage vs Input Code
16.0
14.0
12.0
10.0
8.0
85°C
6.0
25°C
4.0 -20°C
2.0
0.0
0 12 34 56
SUPSPupLpYlyVVOoltLaTgeA:GVECC:V[VC] C[V]
Figure 4. Circuit Current vs Supply Voltage
(Current Consumption at Power Down)
0.4
0.3
0.2
0.1
0.0
-0.1
-0.2
-0.3
-0.4
0
VCC=3.0V
64 128 192
INPInUpuTt CCodOeD[dEec[]dec]
256
Figure 6. Differential Non Linearity Error vs Input Code
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/16
TSZ02201-0M2M0GZ15070-1-2
06.Nov.2015 Rev.001
5 Page 
BH2226FV BH2226F
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/16
TSZ02201-0M2M0GZ15070-1-2
06.Nov.2015 Rev.001
11 Page | ||
| Páginas | Total 20 Páginas | |
| PDF Descargar | [ Datasheet BH2226F.PDF ] | |
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