82541ER 반도체 회로 부품 판매점
Gigabit Ethernet Controller
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 Intel Corporation |
www.DataSheet4U.com
82541ER Gigabit Ethernet Controller
Networking Silicon
Datasheet
Product Features
■ PCI Bus
— PCI revision 2.3, 32-bit, 33/66 MHz
— Algorithms that optimally use advanced PCI,
MWI, MRM, and MRL commands
— 3.3 V (5 V tolerant PCI signaling)
■ MAC Specific
— Low-latency transmit and receive queues
— IEEE 802.3x-compliant flow-control support
with software-controllable thresholds
— Caches up to 64 packet descriptors in a single
burst
— Programmable host memory receive buffers
(256 B to 16 KB) and cache line size (16 B to
256 B)
— Wide, optimized internal data path
architecture
— 64 KB configurable Transmit and Receive
FIFO buffers
■ PHY Specific
— Integrated for 10/100/1000 Mb/s operation
— IEEE 802.3ab Auto-Negotiation support
— IEEE 802.3ab PHY compliance and
compatibility
— State-of-the-art DSP architecture implements
digital adaptive equalization, echo
cancellation, and cross-talk cancellation
— Automatic polarity detection
— Automatic detection of cable lengths and
MDI vs. MDI-X cable at all speeds
■ Host Off-Loading
— Transmit and receive IP, TCP, and UDP
checksum off-loading capabilities
— Transmit TCP segmentation
— Advanced packed filtering
— Jumbo frame support up to 16 KB
— Intelligent Interrupt generation (multiple
packets per interrupt)
■ Manageabiltiy
— Network Device Class Power Management
Specification 1.1
— Compliance with PCI Power Management
1.1 and ACPI 2.0
— SNMP and RMON statistic counters
— D0 and D3 power states
■ Additional Device
— Four programmable LED outputs
— On-chip power control circuitry
— BIOS LAN Disable pin
— JTAG (IEEE 1149.1) Test Access Port built
in silicon
■ Lead-freea 196-pin Ball Grid Array (BGA).
Devices that are lead-free are marked with a
circled “e1” and have the product code:
LUxxxxxx.
a. This device is lead-free. That is, lead has not been intentionally added, but lead may still exist as an impurity at
<1000 ppm. The Material Declaration Data Sheet, which includes lead impurity levels and the concentration of other
Restriction on Hazardous Substances (RoHS)-banned materials, is available at:
ftp://download.intel.com/design/packtech/material_content_IC_Package.pdf#pagemode=bookmarks
In addition, this device has been tested and conforms to the same parametric specifications as previous versions of
the device.
For more information regarding lead-free products from Intel Corporation, contact your Intel Field Sales represen-
tative
Revision 4.1
September 2006
Revision History
Date
Aug 2003
Mar 2004
Oct 2004
Nov 2004
Jan 2005
Feb 2005
Apr 2005
July 2005
Aug 2005
June 2006
June 2006
Aug 2006
Sept 2006
Revision
2.0
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
Notes
Non-classified release.
Updated Section 4, “Voltage, Temperature, and Timing Specifications,” for the
C-0 stepping.
• Corrected EEMODE signal description.
• Updated signal names to match design guide and reference schematics.
• Added lead free information.
• Added information about migrating from a 2-layer 0.36 mm wide-trace
substrate to a 2-layer 0.32 mm wide-trace substrate. Refer to the section
on Package and Pinout Information.
• Added statement that no changes to existing soldering processes are
needed for the 2-layer 0.32 mm wide-trace substrate change in the
section describing “Package Information”.
• Corrected pinout discrepancies between sections “Signal Descriptions”
and “Package and Pinout Information”.
• Added new maximum values for DC supply voltages on 1.2 V and 1.8 V
pins. See Table 2, Recommended Operating Conditions and Table 6, DC
Characteristics.
• Updated Visual Pin Assignment diagram for pinouts F9, F10, E14, F14,
and H14.
• Removed all references to CLK_RUN# signal.
• Corrected the FLSH_SO/LAN_DISABLE signal definition. If Flash
functionality is not used then an external pull-down resistor is required.
• Added pin C8 description to Table 29 and Table 31.
• Corrected 25 MHz Clock Input Requirements in Table 13.
• Corrected the FLSH_SO/LAN_DISABLE signal definition. If Flash
functionality is not used then an external pull-up resistor is required.
• Updated Table 13 “25 MHz Clock Input Requirements”.
• Updated Table 40 descriptions for pins A10, B10, and C9.
• Updated pinout descriptions from Tables 25 - 42 to match Figure 13.
• Removed note “b” from Table 2 and note “a” from Tables 3 and 4. Moved
the note following Table 5 before Table 3 “3.3V Supply Voltage Ramp”.
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The 82541ER Gigabit Ethernet Controller may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at http://www.intel.com.
Intel® is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
Copyright © Intel Corporation, 2006
*Third-party brands and names are the property of their respective owners.
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