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HRS |
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm Board-to-Board Connections
FX11 Series
Stacking height : 2mm
Stacking height : 2.5mm, 3mm
■Features
1. Low Profile Design
The board to board mating height of 2mm, 2.5mm and 3mm suits
smaller, thinner case designs.
2. Improved Transmission Efficiency Between Boards
Transmission characteristics have been improved through
a design that fixes ground plates to both sides of the
header and receptacle.
3. 10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10:1 with the
ground plate SMT connected to the board. The ground
stability achieved serves to reduce noise.
4. Metal Fittings for Added Solder Weld Strength
Metal fittings provide greater adhesion to the board,
protecting against peeling.The unique connector design
provides a connection between the fitting and the ground
plate for a stronger ground.
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm produces a smaller
connector utilizing less board area for mounting.
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT
portion to prevent solder wicking.
7. High contact reliability
Effective mating length is 0.55mm (2mm height),
1mm(2.5mm, 3mm height) for signal contacts.
8. Optional Ground Plate
An alternate style without the ground plate is available.The
space provided by the ground plate removal has been filled
with additional signal contacts.
■Applications
Notebook computers, PDA, and other miniature electronic equipment.
10 Signal: 1 Ground Arrangement
Housing
Metal fitting
0.5mm
0.75mm
Ground Plate
Signal contact
0.75mm
Ground plate and metal fitting make contact
Stacking height variation
2mm 2.5 , 3
mm
Note: 2.0mm type and 2.5mm, 3mm type are not mated with each other.
Structure Prevent solder vicking
Contact
surface
Solder gap portion
Board mounting portion
Land
A222
Free Datasheet http://www.datasheet-pdf.com/
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
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BStacking height variation
● With ground plate
Receptacle
Header
FX11L#-πS / π-SV
FX11L#-πP / π-SV
2mm
Receptacle
Header
FX11#-πS / π-SV
● Without ground plate
Receptacle
Header
FX11L#-πS-SV
FX11#-πP / π-SV
2.5mm
FX11L#-πP-SV
2mm
FX11#-πP / π-SV0.5
3mm
Receptacle
FX11#-πS-SV
Header
FX11#-πP-SV
2.5mm
FX11#-πP-SV0.5
3mm
Note 1: The thickness of the solder paste is not included in the stacking height.
Note 2: 2mm type and 2.5mm, 3mm type, with ground plate type and without ground type are not mated with each other.
BCross section of mating
● Stacking height : 2mm
Signal portion
Ground portion
Header
Receptacle
● Stacking height : 2.5mm, 3mm
Signal portion
Ground portion
Header
(Shown for stacking height 2.5mm type.)
Receptacle
A223
Free Datasheet http://www.datasheet-pdf.com/
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