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MULTILAYER CERAMIC CHIP CAPACITORS



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KHC201ExxxMxxN0Txx 데이터시트, 핀배열, 회로
DataSheet.in
MULTILAYER CERAMIC CHIP CAPACITORS
/
(Down sized)
(High Reliability)
?FEATURES
1. Small in size and wide capacitance range.
2. Temperature characteristic is Y5U in EIA code.
3. Superior humidity characteristic and long life.
4. Excellent high frequency characteristic due to low ESR.
5. High rated ripple current.
?APPLICATIONS
1. Smoothing circuit of small size DC-DC converter.
2. On-board power supply.
3. Noise suppressor for various kinds of equipments.
4. By-pass or decoupling circuits.
?CONSTRUCTION
Ceramic Dielectric
Termination
Solder or Tin Plating
(21, 31, 32, 43size : For flow or reflow soldering)
(55, 76size : For reflow soldering only)
Silver plating (THC Series only)
(All sizes : For reflow soldering only)
Internal Electrode
?RATINGS
1. Category Temperature Range
2. Rated Voltage Range
3. Rated Capacitance Range
4. Rated Capacitance Tolerance
5. Temperature Characteristics
6. Rated Ripple Current
-55 to +125C
16, 25, 50, 100, 200Vdc
0.047 to 100MF
M (P20%) , Z (P8200%)
E (JIS) Y5U (EIA)
See No.5 on the following table
?SPECIFICATIONS
No. Items
1 Withstand Voltage
2 Insulation Resistance
3 Rated Capacitance
4 Dissipation Factor
5 Rated Ripple Current
Specification
No abnormality.
1000/CR(MO) or 10000(MO)
whichever is less.
Within specified tolerance.
5.0% maximum.
Size code 21 31 32 43 55 76
Arms 0.2 0.3 0.5 1.0 2.0 3.0
Test Condition
250% of rated voltage shall be applied for 5 seconds.
Rated voltage shall be applied for 60P5 seconds at
temperature 20P2C.
Temperature
Frequency
Voltage
: 20P2C
: 1P0.1kHz
: 1P0.2Vrms
Temperature
Frequency
Voltage
: 20P2C
: 1P0.1kHz
: 1P0.2Vrms
10kHzK1MHz (sine curve)
Ripple voltage Vp shall be less than
the rated voltage.
(1/4)
CAT. No. E1002I


KHC201ExxxMxxN0Txx 데이터시트, 핀배열, 회로
DataSheet.in
MULTILAYER CERAMIC CHIP CAPACITORS
/
?SPECIFICATIONS
No. Items
6 Adhesion
Specification
No visible damage.
Test Condition
Substrate
5N (0.51kgf)
for 10P1 seconds
Capacitor
7 Bend strength of the face plating Appearance : No visible damage.
DC/C : P15%
The substrate shall be bend by 1mm at a rate of 1mm/s
for 5 seconds.
Capacitor
Press
Press ber
Substrate
45P2mm 45P2mm
1.0mm
Support
8 Solderability
9 Resistance to Soldering Heat
Min. 75% of surface of the termination
shall be covered with new solder
Appearance : No visible damage.
DC/C : P15%
D.F. : To meet the initial specification.
I.R. : To meet the initial specification.
Withstand voltage : No abnormality.
Solder Temperature : 235P5C
Dipping Time : 2P0.5 sec.
Solder : Eutectic solder containning Ag2.5 to 3wt%
Solder Temperature : 260P5C
Dipping Time
: 2P0.5 seconds
Solder
: Eutectic solder containning
Ag2.5 to 3wt%
10 Temperature Cycle
11 Humidity Load Life
Appearance : No visible damage.
DC/C : P15%
D.F. : To meet the initial specification.
I.R. : To meet the initial specification.
Withstand voltage : No abnormality.
Appearance : No abnormality.
DC/C : P20%
D.F. : 7% maximum
I.R. : 50/CR(MO) or 1000(MO)
whichever is less.
Withstand voltage : No abnormality.
Step
Temperature (C)
1 Min. Category temperature P3
2 Room temperature
3 Max. Category temperature P2
4 Room temperature
<Cycle>
THC series : 5 cycles
TMC series : 100 cycles
Temperature : 40P2C
Humidity : 90 to 95%RH
Voltage : Rated voltage
Time
: 500P204hours
(min.)
30P3
3 max.
30P3
3 max.
12 Endurance
*CR : Rated Capacitance(MF)
Appearance : No abnormality.
DC/C : P20%
D.F. : 7% maximum
I.R. : 100/CR(MO) or 1000(MO)
whichever is less.
Withstand voltage : No abnormality.
Temperature : 85P2C
Voltage : 200% of rated voltage.
Time
: 1000P408hours
Temperature : 125P3C
Voltage : Rated voltage
Time
: 1000P408hours
(2/4)
CAT. No. E1002I




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