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PDF 74LCX07 Data sheet ( Hoja de datos )

Número de pieza 74LCX07
Descripción Low Voltage Hex Buffer with Open Drain Outputs
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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No Preview Available ! 74LCX07 Hoja de datos, Descripción, Manual

December 2013
74LCX07
Low Voltage Hex Buffer with Open Drain Outputs
Features
5V tolerant inputs
2.3V to 5.5V VCC specifications provided
2.9ns tPD max. (VCC = 3.3V), 10µA ICC max.
Power down high impedance inputs and outputs
+24mA output drive (VCC = 3.0V)
Implements proprietary noise/EMI reduction circuitry
Latch-up performance exceeds JEDEC 78 conditions
ESD performance:
– Human body model > 2000V
– Machine model > 200V
Leadless DQFN package
General Description
The LCX07 contains six buffers. The inputs tolerate volt-
ages up to 7V allowing the interface of 5V systems to 3V
systems.
The outputs of the LCX07 are open drain and can be
connected to other open drain outputs to implement
active HIGH wire AND or active LOW wire OR functions.
The 74LCX07 is fabricated with advanced CMOS tech-
nology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Ordering Information
Package
Order Number Number
Package Description
74LCX07M
M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74LCX07SJ
74LCX07BQX(1)
M14D
MLP14A
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 3.0mm
74LCX07MTC
MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Note:
1. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©1999 Fairchild Semiconductor Corporation
74LCX07 Rev. 1.11.1
www.fairchildsemi.com

1 page




74LCX07 pdf
Dynamic Switching Characteristics
Symbol
VOLP
VOLV
Parameter
Quiet Output Dynamic Peak VOL
Quiet Output Dynamic Valley VOL
VCC (V)
3.3
2.5
3.3
2.5
Conditions
CL = 50pF, VIH = 3.3V, VIL = 0V
CL = 30pF, VIH = 2.5V, VIL = 0V
CL = 50pF, VIH = 3.3V, VIL = 0V
CL = 30pF, VIH = 2.5V, VIL = 0V
TA = 25°C
Typical
0.9
0.7
–0.8
–0.6
Unit
V
V
Capacitance
Symbol
CIN
COUT
CPD
Parameter
Input Capacitance
Output Capacitance
Power Dissipation Capacitance
Conditions
VCC = Open, VI = 0V or VCC
VCC = 3.3V, VI = 0V or VCC
VCC = 3.3V, VI = 0V or VCC, f = 10MHz
Typical
7
8
25
Units
pF
pF
pF
©1999 Fairchild Semiconductor Corporation
74LCX07 Rev. 1.11.1
5
www.fairchildsemi.com

5 Page





74LCX07 arduino
Physical Dimensions (Continued)
0.43 TYP
0.65
1.65
0.45
6.10
R0.09 min
12.00°TOP & BOTTOM
A. CONFORMS TO JEDEC REGISTRATION MO-153,
VARIATION AB, REF NOTE 6
B. DIMENSIONS ARE IN MILLIMETERS
1.00
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS
D. DIMENSIONING AND TOLERANCES PER ANSI
Y14.5M, 1982
E. LANDPATTERN STANDARD: SOP65P640X110-14M
F. DRAWING FILE NAME: MTC14REV6
R0.09min
Figure 6. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1999 Fairchild Semiconductor Corporation
74LCX07 Rev. 1.11.1
11
www.fairchildsemi.com

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