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PDF XD010-22S-D2F Data sheet ( Hoja de datos )

Número de pieza XD010-22S-D2F
Descripción Class A/AB 12W Power Amplifier Module
Fabricantes Sirenza Microdevices 
Logotipo Sirenza Microdevices Logotipo



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Product Description
Sirenza Microdevices’ XD010-22S-D2F 12W power module is a robust 2-
stage Class A/AB amplifier module for use in the driver stages of GSM/
EDGE RF power amplifiers for cellular base stations. The power transistors
are fabricated using Sirenza's latest, high performance LDMOS process.
This unit operates from a single voltage and has internal temperature com-
pensation of the bias voltage to ensure stable performance over the full
temperature range. It is a drop-in, no-tune solution for medium power
applications requiring high efficiency, excellent linearity, and unit-to-unit
repeatability. It is internally matched to 50 ohms.
Functional Block Diagram
Stage 1
Stage 2
Temperature
Compensation
12
Temperature
Compensation
34
5
RF in
V VD1 D2
Case Flange = Ground
RF out
XD010-22S-D2F
1805-1880 MHz Class A/AB
12W Power Amplifier Module
Product Features
50 W RF impedance
12W Output P1dB
Single Supply Operation : Nominally 28V
High Gain: 31 dB at 1840 MHz
High Efficiency: 25% at 1840 MHz
Advanced, XeMOS II LDMOS FETS
Temperature Compensation
Applications
Base Station PA driver
Repeater
GSM / EDGE
Key Specifications
Symbol
Parameter
Frequency
Frequency of Operation
P1dB
Gain
Output Power at 1dB Compression (single tone)
Gain at 5W Output Power (CW)
Gain Flatness
Peak to Peak Gain Variation
IRL Input Return Loss 5W Output (CW)
Efficiency
Drain Efficiency at 10W CW
RMS EVM at 5W EDGE output
Linearity
Peak EVM at 5W EDGE output
3rd Order IMD at 10W PEP (Two Tone; 1MHz F)
Delay
Electrical Delay
Phase Linearity
Deviation from Linear Phase (Peak to Peak)
RTH, j-l
RTH, j-2
Thermal Resistance Stage 1 (Junction to Case)
Thermal Resistance Stage 2 (Junction to Case)
Test Conditions Zin = Zout = 50, VDD = 28.0V, IDQ1 = 230mA, IDQ2 = 115mA, TFlange = 25ºC
Unit
MHz
W
dB
dB
dB
%
%
%
dBc
nS
Deg
ºC/W
ºC/W
Min.
1805
10
28.5
10
20
-26
Typ.
12
31
0.5
14
25
1.5
5
-32
2.5
0.5
11
4
Max.
1880
1.0
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this information, and all such
information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any thrid party. Sirenza Microdevices
does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2003 Sirenza Microdevices, Inc. All worldwide rights reserved.
303 S. Technology Court,
Phone: (800) SMI-MMIC
http://www.sirenza.com
Broomfield, CO 80021
1 EDS-102930 Rev C

1 page




XD010-22S-D2F pdf
Package Outline Drawing
XD010-22S-D2F 1805-1880 MHz 12W Power Amp Module
Recommended PCB Cutout and Landing Pads for the D2F Package
Note 3: Dimensions are in inches
Refer to Application note AN-060 “Installation Instructions for XD Module Series” for additional mounting info. App note availbale at at www.sirenza.com
303 S. Technology Court
Broomfield, CO 80021
Phone: (800) SMI-MMIC
5
http://www.sirenza.com
EDS-102930 Rev C

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