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BGA420 반도체 회로 부품 판매점

Si-MMIC-Amplifierin SIEGET 25-Technologie (Cascadable 50 -gain block Unconditionally stable)



Siemens Semiconductor Group 로고
Siemens Semiconductor Group
BGA420 데이터시트, 핀배열, 회로
BGA 420
Si-MMIC-Amplifier in SIEGET® 25-Technologie
Preliminary data
Cascadable 50 -gain block
Unconditionally stable
Gain |S21|2 = 13 dB at 1.8 GHz
IP3out = +9 dBm at 1.8 GHz
(VD = 3 V, ID = typ. 6.4 mA)
Noise figure NF = 2.2 dB at 1.8 GHz
Reverse isolation > 28 dB and
return loss IN / OUT > 12 dB at 1.8 GHz
3
4
2
1 VPS05605
VD
4
Circuit Diagram
3 OUT
1
IN
2
GND
EHA07385
ESD: Electrostatic discharge sensitive device, observe handling precaution!
Type
Marking Ordering Code Pin Configuration
BGA 420 BLs Q62702-G0057 1, IN 2, GND 3, OUT 4, VD
Package
SOT-343
Maximum Ratings
Parameter
Symbol
Value
Unit
Device current
Device voltage
Total power dissipation, TS tbd °C
RF input power
Junction temperature
Ambient temperature
Storage temperature
Thermal Resistance
Junction - soldering point 1)
ID
VD
Ptot
PRFin
Tj
TA
Tstg
RthJS
15
6
90
0
150
-65 ...+150
-65 ...+150
tbd
mA
V
mW
dBm
°C
K/W
1) TS is measured on the emitter (GND) lead at the soldering point to the pcb
SSeemmicioconndduuctcotor rGGrorouupp
11
Jul1-91938--11919-081


BGA420 데이터시트, 핀배열, 회로
BGA 420
Electrical Characteristics at TA = 25 °C, unless otherwise specified.
Parameter
Symbol
Values
Unit
min. typ. max.
AC characteristics
Device current
Insertion power gain
f = 0.1 GHz
ID
|S21|2
5.4 6.7
17 19
8 mA
dB
-
f = 1 GHz
15 17
-
f = 1.8 GHz
Reverse isolation
f = 1.8 GHz
11 13
-
S12
25 28
-
Noise figure
NF
f = 0.1 GHz
- 1.9 2.2
f = 1 GHz
- 2 2.3
f = 1.8 GHz
- 2.2 2.5
Intercept point at the output
f = 1 GHz
1dB compression point
f = 1 GHz
Return loss input
f = 1.8 GHz
Return loss output
f = 1.8 GHz
IP3out
P-1dB
RLin
RLout
7.5 9
-2.5 -1
8 11
12 16
- dBm
-
- dB
-
Typical biasing configuration
+VD
100 pF
100 pF
RF IN
10 nF
100 pF
43
BGA 420
12
GND
RF OUT
EHA07386
Note: 1) Large-value capacitors should be connected from pin 4 to ground right at the device
to provide a low impedance path!
2) The use of plated through holes right at pin 2 is essential for pc-board-applications. Thin
boards are recommended to minimize the parasitic inductance to ground!
SSeemmicioconndduuctcotor rGGrorouupp
22
Jul1-91938--11919-081




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제조업체: Siemens Semiconductor Group

( siemens )

BGA420 amplifier

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